A postdeposition thermal treatment has been applied to sputtered Al-doped zinc oxide films and shown to strongly decrease the resistivity of the films. While high temperature annealing usually leads to deterioration of electrical transport properties, a silicon capping layer successfully prevented the degradation of carrier concentration during the annealing step. The effect of annealing time and temperature has been studied in detail. A mobility increase from values of around 40 cm2/Vs up to 67 cm2/Vs, resulting in a resistivity of 1.4×10−4 Ω cm has been obtained for annealing at temperatures of 650 °C. The high mobility increase is most likely obtained by reduced grain boundary scattering. Changes in carrier concentration in the films caused by the thermal treatment are the result of two competing processes. For short annealing procedures we observed an increase in carrier concentration that we attribute to hydrogen diffusing into the zinc oxide film from a silicon nitride barrier layer between the zinc oxide and the glass substrate and the silicon capping layer on top of the zinc oxide. Both are hydrogen-rich if deposited by plasma-enhanced chemical vapor deposition. For longer annealing times a decrease in carrier concentration can occur if a thin capping layer is used. This can be explained by the deteriorating effect of oxygen during thermal treatments which is well known from annealing of uncapped zinc oxide films. The reduction in carrier concentration can be prevented by the use of capping layers with thicknesses of 40 nm or more.

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The H flux to Si growth flux ratio is experimentally determined under state-of-the-art silicon thin-film deposition conditions by employing the recently introduced etch product detection technique. Under the technologically relevant high-pressure depletion conditions and for different process parameter settings such as pressure, SiH4 concentration, rf power, and excitation frequency, it was demonstrated that the microcrystalline to amorphous silicon phase transition is uniquely and reactor independently determined by the flux ratio of H and Si growth species.

The influence of oxygen and nitrogen impurities on the performance of thin-film solar cells based on microcrystalline silicon (mu c-Si:H) has been systematically investigated. Single mu c-Si:H layers and complete mu c-Si:H solar cells have been prepared with intentional contamination by admitting oxygen and/or nitrogen during the deposition process. The conversion efficiency of similar to 1.2 mu m thick mu c-Si: H solar cells is deteriorated if the oxygen content in absorber layers exceeds the range from 1.2 x 10(19) to 2 x 10(19) cm(-3); in the case of nitrogen contamination the critical impurity level is lower ([N](critical)=6 x 10(18)-8 x 10(18) cm(-3)). It was revealed that both oxygen and nitrogen impurities thereby modify structural and electrical properties of mu c-Si:H films. It was observed that the both contaminant types act as donors. Efficiency losses due to oxygen or nitrogen impurities are attributed to fill factor decreases and to a reduced external quantum efficiency at wavelengths of >500 nm. In the case of an air leak during the mu c-Si:H deposition process, the cell performance drops at an air leak fraction from 140 to 200 ppm compared to the total gas flow during i-layer deposition. It is demonstrated that oxygen and nitrogen impurities close to the p/i-interface have a stronger effect on the cell performance compared to impurities close to the n/i-interface. Moreover, thick mu c-Si:H solar cells are found to be more impurity-sensitive than thinner cells

Silicon based thin tandem solar cells were fabricated by plasma enhanced chemical vapor deposition (PECVD) in a 30 × 30 cm2 reactor. The layer thicknesses of the amorphous top cells and the microcrystalline bottom cells were significantly reduced compared to standard tandem cells that are optimized for high efficiency (typically with a total absorber layer thickness from 1.5 to 3 µm). The individual absorber layer thicknesses of the top and bottom cells were chosen so that the generated current densities are similar to each other. With such thin cells, having a total absorber layer thickness varying from 0.5 to 1.5 µm, initial efficiencies of 8.6–10.7% were achieved. The effects of thickness variations of both absorber layers on the device properties have been separately investigated. With the help of quantum efficiency (QE) measurements, we could demonstrate that by reducing the bottom cell thickness the top cell current density increased which is addressed to back‐reflected light. Due to a very thin a‐Si:H top cell, the thin tandem cells show a much lower degradation rate under continuous illumination at open circuit conditions compared to standard tandem and a‐Si:H single junction cells. We demonstrate that thin tandem cells of around 550 nm show better stabilized efficiencies than a‐Si:H and µc‐Si:H single junction cells of comparable thickness. The results show the high potential of thin a‐Si/µc‐Si tandem cells for cost‐effective photovoltaics. Copyright © 2010 John Wiley & Sons, Ltd.