Transient creep characteristics in two Pb–Sn–Zn ternary alloys

El-Daly, A.A.; Abdel‐Daiem, A. M.; Yousf, M

doi:10.1016/s0254-0584(00)00505-8

Cited by 12 publications

(7 citation statements)

References 12 publications

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“…A cooling rate was achieved, so as to create the fine microstructure typically found in small solder joints in microelectronic packages [8]. Tensile creep tests were then performed under constant stresses ranging from 3.62 to 11.22 MPa, and at temperatures ranging from 323 to 403 K in 20 K increments for both alloys, with an experimental error of less than ± 3% [11]. The sensitivity of strain measurements was approximately ±1.0 × 10 -2 and the accuracy of temperature measurements is of the order of ±1 K. The environment chamber temperature could be monitored by using a thermocouple contacting with specimen.…”

Section: Methodsmentioning

confidence: 99%

“…It is well known that Sn-Zn solder alloys exhibit strong time-dependent deformation behavior, and the mechanical response of the solder can be controlled by varying their structural state, in particular, the grain boundary area and the addition of various alloying elements [11,12]. Since the creep is one of the most common and important micromechanical deformation mechanisms in solder joints, it is necessary to find out how the creep parameters changing with alloying additions, structural transformations and applied stresses.…”

Section: Introductionmentioning

confidence: 99%

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Effects of Cu addition on creep characteristics of Sn–9Zn lead-free solders

2016

Egyptian Journal of Solids

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In the present study, the transient, and steady state creep of Sn-9Sn and Sn-9Sn-0.7Cu ternary alloy was investigated in the temperature range from 323, to 403 K at different five stresses ranged from 3.62 to 11.22 MPa. The transient creep parameters n and β were found to be markedly affected by the creep test conditions, T and ϭ. The parameter β was found to be increased by increasing transformation temperature, also; n was found to increase by increasing T irrespective of the applied stress. The steady-state creep rate ε´st was found to increase with increasing both T and ϭ for two alloys. The relationship between steady-state creep rate ε´st and the stress is ε´st = Cϭ m where m=(∂lnε´st/∂lnϭ), is the strain rate sensitivity parameter. This exponent is increased with increasing T in both alloys. Addition of small amount of 0.7Cu to the binary alloy increased its creep resistance and ductility and was found to be enhancing the plasticity of the ternary alloys. This behavior was attributed to the formation of the intermetallic compounds (IMCs) Sn5Zn8 and Cu6Sn5 during solidification. These IMCs played the role of pinning action for the moving dislocations and consequently leading to the increase of its creep resistance. Microstructural changes were investigated by Optical microscope (OM), and X-ray diffraction.

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Section: Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Effects of Cu addition on creep characteristics of Sn–9Zn lead-free solders

2016

Egyptian Journal of Solids

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“…The activation enthalpy of the transient creep Q tr was calculated using the following equation [31]:…”

Section: Strainmentioning

confidence: 99%

Effect of small addition Indium on transient and steady-state creep characteristics, microstructure and properties of Sn-9Zn lead-free solders

Salem

2018

Arab Journal of Nuclear Sciences and Applications

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Complete enforcement of the new propagation of lead-free solders needed detailed knowledge and comprehension of their mechanical attitude. In the present study transient and steady-state creep tests, microstructure and characteristic of Sn-9Zn lead free solders and Sn-9Zn-2In ternary alloys were studied under different five applied stresses ranging from ranged from 3.62 to 11.22 MPa and in the temperature range from 323K to 403K. It is obvious that the addition of Indium to the Sn-9Zn binary system lead to a reducing of the melting point, therefore, the Sn-9Z-2In solder material shows maximum ductility (strain) and well-behaved mechanical realization than that of eutectic Sn-9Zn commercial solder. Microstructural analysis revealed that the ternary alloys are more fine and refining than binary due to existence of γ-InSn 4. The activation energy of transient creeps have been found to be 20.16-26.32 and 16.80-22.44 kJ mol −1 in the low and high temperature regions for Sn-9Zn binary and Sn-9Z-2In ternary alloys respectively. The steady state creep was studied in the same temperature range under same loads. The strain rate sensitivity parameter (m) has been found to elevate by elevating the applied temperature and stresses. The activation energies of steady state creep of the alloy have been found to be 26.31-30.82 and 23.36-27.13 kJ mol −1 in the low and high temperature regions for Sn-9Zn binary and Sn-9Z-2In ternary alloys, respectively.

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“…Several reviews show the effects of sulfur and carbon black contents as reinforc-ing fillers loaded into rubber matrix to improve physicochemical properties. [13][14][15][16] The possibilities offered by TiB 2 reinforcement of IIR composites have not yet been fully exploited. In the present work, a new type of composite material, viz., TiB 2 powder reinforced IIR composites, was developed.…”

Section: Introductionmentioning

confidence: 99%

The interrelation among network structures, molecular transport of solvent, and creep behaviors of TiB₂ ceramic containing butyl rubber composites

El-Tantawy

2005

J of Applied Polymer Sci

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Swelling of polymer composites in solvents has become one of the major problems in the use of polymer composites exposed to petroleum products. As a possible solution to the problem, this experimental study was conducted to examine the potential application of TiB 2 ceramic in butyl rubber (IIR) composites. The effect of TiB 2 content on the curing kinetics of IIR composites was studied using a torque rheometer technique. The effect of TiB 2 on the network structure was investigated in terms of the crosslinking density, interparticle distance between conducting particles, surface tension, glass transition temperature, degree of crystallinity, scanning electron microscopy, and X-ray analysis. Moreover, the effect of TiB 2 content on the molecular transport of solvent (kerosene) was examined by means of degree of swelling, solvent interaction parameters, volume fraction of rubber, interparticle distance after swelling, penetration rate of solvent, mean diffusion coefficient, cohesive energy density of polymer, standard entropy, standard enthalpy, and standard free energy of IIR composites. It was ascertained that with increasing TiB 2 content the degree of swelling shifts to a lower value. The main reason was interpreted as the introduction of good interface adhesion of TiB 2 with rubber matrix, which tends to block the diffusion of solvent molecules. The effect of TiB 2 content on hardness, tensile strength, Young's modules, and elongation at break is discussed. An apparent steady-state creep of butyl rubber IIR/ TiB 2 composites is evident under different constant stresses at room temperature. The strain rate of steady-state creep showed a dependence on stress and TiB 2 volume fraction. The stress sensitivity parameter, viscosity coefficient, and activation volume for samples loaded with different content of TiB 2 were estimated. It is apparent that these new composites should be very useful for solvent permeation resistance at high TiB 2 loading level with good mechanical properties.

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Transient creep characteristics in two Pb–Sn–Zn ternary alloys

Cited by 12 publications

References 12 publications

Effects of Cu addition on creep characteristics of Sn–9Zn lead-free solders

Effects of Cu addition on creep characteristics of Sn–9Zn lead-free solders

Effect of small addition Indium on transient and steady-state creep characteristics, microstructure and properties of Sn-9Zn lead-free solders

The interrelation among network structures, molecular transport of solvent, and creep behaviors of TiB₂ ceramic containing butyl rubber composites

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Transient creep characteristics in two Pb–Sn–Zn ternary alloys

Cited by 12 publications

References 12 publications

Effects of Cu addition on creep characteristics of Sn–9Zn lead-free solders

Effects of Cu addition on creep characteristics of Sn–9Zn lead-free solders

Effect of small addition Indium on transient and steady-state creep characteristics, microstructure and properties of Sn-9Zn lead-free solders

The interrelation among network structures, molecular transport of solvent, and creep behaviors of TiB2 ceramic containing butyl rubber composites

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The interrelation among network structures, molecular transport of solvent, and creep behaviors of TiB₂ ceramic containing butyl rubber composites