2012
DOI: 10.2494/photopolymer.25.255
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Transfer of Relatively Large Microstructures on Polyimide Films using Thermal Nanoimprinting

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Cited by 10 publications
(9 citation statements)
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“…Hot embossing, or nanoimprinting, onto polyimide films has also been characterized to construct deep features (>100 μm) [74,75]. This technique is similar to standard hot embossing of polymers utilizing a micropatterned Si mold that is pressed into the polymer substrate that is heated above its T g (T g = 275 °C for polyimide).…”
Section: Bonding Techniquesmentioning
confidence: 99%
“…Hot embossing, or nanoimprinting, onto polyimide films has also been characterized to construct deep features (>100 μm) [74,75]. This technique is similar to standard hot embossing of polymers utilizing a micropatterned Si mold that is pressed into the polymer substrate that is heated above its T g (T g = 275 °C for polyimide).…”
Section: Bonding Techniquesmentioning
confidence: 99%
“…The device was based on the concept of a MEMS glucose fuel cell design to allow continuous operation of the fuel cell as reported by Togo et al (12) . This paper details the fabrication and characterization of a miniaturized AAFC with a microchannel fabricated on PI substrates using thermal nanoimprinting techniques ( 13)- (16) and MEMS technologies.…”
Section: Introductionmentioning
confidence: 99%
“…42) Therefore, a power source with an area of cm 2 order, equivalent to the area of a current cardiac pacemaker, must exhibit a power density of 10 µW=cm 2 in an aqueous an AA solution with an AA concentration between 23 and 85 µM. Mogi et al 43) reported the fabrication and characterization of a miniaturized AAFC with a microchannel fabricated on a PI substrate using thermal nanoimprinting techniques [44][45][46][47] and MEMS technologies. However, they utilized porous carbon electrodes deposited on a flexible PI film, and these electrodes cracked after repeated bending of the BFC.…”
Section: Introductionmentioning
confidence: 99%