Towards the optical inspection sensitivity optimization of EUV masks and EUVL-exposed wafers

Okoroanyanwu, U.; Heumann, Jan; Zhu, Xingyi; Clifford, Chris; Jiang, Fan; Mangat, Pawitter J. S.; Ghaskadavi, R.; Mohn, E.; Moses, R.; Wood, O. R.; Rolff, Haiko; Cantrell, Rusty; Nesládek, Pavel; LiCausi, Nicholas; Cai, Xin; Taylor, William J.; Schefske, Jeffrey; Bender, Markus; Schmidt, N.M.

doi:10.1117/12.923134

Cited by 7 publications

(1 citation statement)

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“…One example is semiconductor manufacturing process, where silicon wafers need to be cleaned thoroughly to eliminate the 'killer particles' prior to further processing. With the advent of substrates like organic electroluminescent materials, having completely different surface topology than silicon, or EUV lithography with more stringent cleaning requirement [5,6], this problem is getting more diversified, critical and challenging now-a-days. Besides detection, locating the detected particles and classifying them according to their sizes without carrying out any additional measurement is also a desirable additional information required in many practical situations other than those mentioned above, for example, engineering of optical nano-circuits [7].…”

Section: Introductionmentioning

confidence: 99%

Coherent Fourier scatterometry for detection of nanometer-sized particles on a planar substrate surface

Roy¹,

Assafrao²,

Pereira³

et al. 2014

Opt. Express

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Inspection tools for nano-particle contamination on a planar substrate surface is a critical problem in micro-electronics. The present solutions are either expensive and slow or inexpensive and fast but have low sensitivity because of limitations due to diffraction. Most of them are also substrate specific. In this article we report how Coherent Fourier Scatterometry is used for detection of particles smaller than λ /4. Merits of the technique, especially, the procedures to improve SNR, its flexibility and its robustness on rough surfaces are discussed with simulated and experimental results. M. Bullis, B. W. Scheer, and J. Stover, "Measurement of silicon particles by laser surface scanning and angleresolved light scattering," J. Electrochem. Soc. 144(1), 243-250 (1997). 11. A. Okamoto, H. Kuniyasu, and H. Takeshi, "Detection of 3040-nm particles on bulk-silicon and SOI wafers using deep UV laser scattering," IEEE Trans.

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Section: Introductionmentioning

confidence: 99%