Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)
DOI: 10.1109/stherm.2001.915175
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Tool for fast modelling active heat sinks

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Cited by 8 publications
(5 citation statements)
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“…Some papers, e.g. (Dziurdzia and Kos, 2001;Janicki et al, 2011Janicki et al, , 2012 are related to the use of the Peltier modules in cooling systems of semiconductor devices. The paper (Dziurdzia and Kos, 2001) presents a tool for electrothermal simulation and very fast modeling of active heat-sinks.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…Some papers, e.g. (Dziurdzia and Kos, 2001;Janicki et al, 2011Janicki et al, , 2012 are related to the use of the Peltier modules in cooling systems of semiconductor devices. The paper (Dziurdzia and Kos, 2001) presents a tool for electrothermal simulation and very fast modeling of active heat-sinks.…”
Section: Introductionmentioning
confidence: 99%
“…(Dziurdzia and Kos, 2001;Janicki et al, 2011Janicki et al, , 2012 are related to the use of the Peltier modules in cooling systems of semiconductor devices. The paper (Dziurdzia and Kos, 2001) presents a tool for electrothermal simulation and very fast modeling of active heat-sinks. By means of this tool, one can find values of current supplying a Peltier module to change the temperature of a cooled object according to a given algorithm.…”
Section: Introductionmentioning
confidence: 99%
“…These results are shown for a selected set of proportional-integral-derivate (PID) and system gains. [4].…”
Section: B Classical Small-signal Methodsmentioning
confidence: 99%
“…Recent works have presented Spice modeling techniques for TEC's [4,5] and discussed the approach of heterogeneous modeling solutions [6]. A limitation in some of these models is their non-invertibility between electrical and thermal domains or their reliance on ideal heat sinking of the TEC hot side.…”
Section: Tec Spice Modelmentioning
confidence: 99%
“…The first models of the thermoelectric modules that were implemented into electronic circuits' simulators were working in cooling mode. In [53], an analysis of a developed PSPICE-compatible equivalent circuit of a thermoelectric cooler was demonstrated, whereas in [54,55], an electrothermal macromodel of an active heat sink based on TEM for cooling process simulation was described. In [56], a modified electrothermal model of TEMs was demonstrated, with temperature-dependent material properties taken into consideration.…”
Section: Electro-thermal Analogy-based Teg Modelmentioning
confidence: 99%