Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow

Abstract

Purpose The purpose of this study is to investigate the validation of the usefulness of cooling systems containing Peltier modules for cooling power devices based on measurements of the influence of selected factors on the value of thermal resistance of such a cooling system. Design/methodology/approach A cooling system containing a heat-sink, a Peltier module and a fan was built by the authors and the measurements of temperatures and thermal resistance in various supply conditions of the Peltier module and the fan were carried out and discussed. Findings Conclusions from the research carried out answer the question if the use of Peltier modules in active cooling systems provides any benefits comparing with cooling systems containing just passive heat-sinks or conventional active heat-sinks constructed of a heat-sink and a fan. Research limitations/implications The research carried out is the preliminary stage to asses if a compact thermal model of the investigated cooling system can be formulated. Originality/value In the paper, the original results of measurements and calculations of parameters of a cooling system containing a Peltier module and an active heat-sink are presented and discussed. An influence of power dissipated in the components of the cooling system on its efficiency is investigated.

Optimal Temperature Regulation of Integrated Circuits with Peltier Heat Pumps

“…The correctness of the theoretical considerations was confirmed with the use of computations. The shape of the obtained dependences is convergent to the results of measurements presented in the paper [36]. The conclusions presented in the previous sections may be useful for designers of electronic components cooling systems.…”

“…All the results of the computer analyses are consistent with the results of theoretical considerations presented in the previous section. Additionally, it is worth underlining that in the paper [36], many results of measurements of the cooling system containing the Peltier module, a heat sink and a fan are presented. Some of these results present measured dependences of thermal resistance and device internal temperature on the current of the Peltier module.…”

Cooling Systems of Power Semiconductor Devices—A Review

“…Figure 19 shows the results of measurements illustrating the influence of the supply current of the thermoelectric module i P and the supply voltage of the heat sink on the thermal resistance of the cooled device [110]. The cooling system includes a thermoelectric module, a heat sink and a fan.…”