Advanced MEMS/NEMS Fabrication and Sensors 2021
DOI: 10.1007/978-3-030-79749-2_1
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Tip-Based Nanofabrication for NEMS Devices

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Cited by 3 publications
(4 citation statements)
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“…They are used for the measurements of mass, stiffness, viscosity, and other physical properties even an individual cell [3]. As Silicon-based MEMS sensors have the limitation of operating at high temperatures high temperature-resistant hard coatings like SiC were used as mentioned above Thin films memristor made from SiC have also shown good binary resistive memory switching which is beneficial for memory devices [4]. The Individual SiC phase is a valence crystal in which neighboring atoms share their valence electrons through the creation of strong homopolar or covalent bonds.…”
Section: Introductionmentioning
confidence: 99%
“…They are used for the measurements of mass, stiffness, viscosity, and other physical properties even an individual cell [3]. As Silicon-based MEMS sensors have the limitation of operating at high temperatures high temperature-resistant hard coatings like SiC were used as mentioned above Thin films memristor made from SiC have also shown good binary resistive memory switching which is beneficial for memory devices [4]. The Individual SiC phase is a valence crystal in which neighboring atoms share their valence electrons through the creation of strong homopolar or covalent bonds.…”
Section: Introductionmentioning
confidence: 99%
“…In reverse to the approach of top-down fabrication, mechanical probes can be fabricated 'bottom-up' by the assembly of nano-or microscale structures that have been synthesized molecule-by-molecule (Pu and Hu, 2022). Such synthesized structures are almost unrestricted in their composition, or may be designed with composition gradients, can have atomically smooth facets, with very low defect densities, and with well-defined surface termination (Ozin and Arsenault, 2015;Bohidar and Rawat, 2017).…”
Section: Introductionmentioning
confidence: 99%
“…These methods often deposit a catalyst at a location of interest on the probe, followed by deposition-based growth of the structure of interest (Hernández-Vélez, 2006;Cao and Liu, 2008). In contrast, grow-and-place strategies synthesize the structure externally, and then use a secondary assembly step to integrate the structure into the probe (Shi et al, 2016;Pu and Hu, 2022). Parallel assembly methods offer the potential to be upscaled for industrial level fabrication, and therefore can be considered the end goal (Yerushalmi et al, 2007;Wang and Gates, 2009).…”
Section: Introductionmentioning
confidence: 99%
“…Microelectromechanical systems (MEMS) are generally known as miniaturized mechanical and electro-mechanical devices that are commonly fabricated by adding new structures or by specifically etching away parts of the silicon chip [1,2]. NEMS stands for nanoelectromechanical systems, an important feature of NEMS devices is that it has at least one dimension smaller than 100 nm [3,4]. As device dimensions decrease, NEMS show new physical properties, namely increase in resonance frequency, improvement in force, mass and displacement sensitivity and low-temperature behaviour that reflects quantum limit, which may dominate the operation of the devices [5][6][7].…”
Section: Introductionmentioning
confidence: 99%