Tin–zinc alloy electrodeposition from aqueous citrate baths

Kazimierczak, Honorata; Ozga, P.; Jałowiec, Aldona; Kowalik, Remigiusz

doi:10.1016/j.surfcoat.2013.12.046

Cited by 32 publications

(15 citation statements)

References 14 publications

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“…[4] In recent years, the electrodeposition of Sn has received considerable attention due to its non-toxicity, high resistance to corrosion, good ductility and its potential for use in electrochemical applications such as electronics and batteries. [5][6][7][8][9] Sn and its alloy coatings have been used in numerous industrial applications such as the automobile industry, [10] microelectronics, [11] aeronautics, [12] and the food industry. [13] Sn and its alloys have been widely used for imparting corrosion resistance to active metal substrates in aggressively corrosive environments.…”

Section: Introductionmentioning

confidence: 99%

Effect of Sodium Bromide on the Electrodeposition of Sn, Cu, Ag and Ni from a Deep Eutectic Solvent-Based Ionic Liquid

Alesary¹

2019

International Journal of Electrochemical Science

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A number of studies into the influence of additives on the electrodeposition of metals from aqueous solution have been reported in the literature. However, very few have studied the influence of additives on metal electrodeposition in Deep Eutectic Solvents (DESs). This work will show, for the first time, the effect of sodium bromide on the electrodeposition of tin, copper, silver and nickel from a deep eutectic solvent (DES)-based ionic liquid consisting of a stoichiometric 1:2 mix of choline chloride and ethylene glycol (Ethaline 200). It is shown that in the presence of sodium bromide, bright and smooth Cu and Ni deposits were formed. Cyclic voltammetry and chronocoulometry have been used to examine the electrochemical properties of the plating liquids in both the absence and presence of sodium bromide. It was found that the redox peak currents of the Sn and Ag electrolytes get smaller when sodium bromide is added to the electrolyte solution. The resultant surface morphologies, topography and roughness of Sn, Cu, Ag and Ni were investigated by scanning electron microscopy (SEM/ EDXS) and 3D optical microscopy (3D). The current efficiency of metal deposits was found to increase when the deposition was achieved from an electrolyte that contained sodium bromide.

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Section: Introductionmentioning

confidence: 99%

Effect of Sodium Bromide on the Electrodeposition of Sn, Cu, Ag and Ni from a Deep Eutectic Solvent-Based Ionic Liquid

Alesary¹

2019

International Journal of Electrochemical Science

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“…New solders, based on Sn-Zn eutectic should eliminate these defects [17,18]. The possibility of electrolytic deposition from non-toxic citrate baths is an important advantage of Sn-Zn alloys [19,20]. In the case of Sn-Ag alloys, obtaining the stable baths requires the use of toxic complex components [21].…”

Section: Introductionmentioning

confidence: 99%

Early stages of wetting of copper by Sn–Zn eutectic alloy

Pstruś

2018

J Mater Sci: Mater Electron

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The manuscript presents studies of the interaction of Sn-Zn eutectic solder alloy with a solid copper substrate, in the early times of the wetting process. The wetting tests were performed using the sessile drop method, with flux, in air, at 230 °C, 250 °C and 280 °C and reflow time of 2 s, 5 s, 10 s, 20 s, 40 s, 90 s and 180 s. The wetting time was measured from the moment of contact of the liquid solder with copper. It was noted, that during the reaction of copper with the liquid solder, an IMC (intermetallic compound) layer formed in the interface. Solidified solder/substrate couples were studied using scanning electron microscopy (SEM) and synchrotron measurements. The intermetallic phases of Cu-Zn system that formed at the solder/substrate interface were identified as epsilon and gamma. The kinetics of the formation and growth of the intermetallic layer were determined. The model describing the sequence of events in the early time of wetting was proposed. The earliest stage of wetting the copper substrate by liquid solder Sn-Zn included: adsorption of Zn atoms on the Cu surface, surface diffusion of Zn atoms on the copper surface, dissolution of the copper pad by the liquid solder and diffusion of Cu atoms into the liquid. In the liquid solder, the copper atoms combined with zinc atoms to create clusters of the epsilon phase. Those clusters coagulated and a short-range ordered (SRO) Cu-Zn structure formed in the liquid. After short heating and cooling, the liquid solidified and the CuZn 5 border-layer appeared in the interface. Further heating caused the saturation of the reaction zone with Cu atoms and the crystallization of two intermetallic phases Cu 5 Zn 8 from the solid support side and CuZn 4 one from the solder side occurred.

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“…Both Zn and Sn are widely used in the industry as a coating material to protect steel against corrosion due to their excellent corrosion resistance . In addition, Zn–Sn alloy layers are widely used as finish coating in various applications such as marine, automobile, aeronautics, and food industries because these materials are inexpensive and have excellent corrosion resistance, high ductility and wear resistance, superb frictional properties, smooth surface, and nontoxicity . When the content of Sn is more than 20% in the Zn–Sn alloy, the protection properties of Zn–Sn alloy films are superb .…”

Section: Introductionmentioning

confidence: 99%

Spectroscopic and Morphological Investigation of ZnSn Thin Films Obtained by Radio Frequency Cosputtering

Lee

Park

Kang

et al. 2017

Bulletin Korean Chem Soc

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In this study, Zn, Sn, and ZnSn (containing 20% of Sn) thin films were fabricated by radio frequency magnetron cosputtering and their properties had been studied with various analytical techniques. The X‐ray photoelectron spectroscopy results showed that the oxidation states of the elements in the alloy thin films change in comparison with the monometallic thin films, namely, Zn was more oxidized wheras Sn was less oxidized. The crystallinity and the conductivity of ZnSn thin films improved compared to monometallic thin films, which were confirmed by X‐ray diffraction (XRD) and four‐point probe. In ZnSn thin films, some Sn thin film formed secondary phase according to the Hume Rothery rules and the other was substituted into Zn sites in the wurtzite hexagonal structure of ZnO. Due to the lattice mismatch, the residual stress was generated and the preferred crystal growth was observed to overcome the stress. This was confirmed by the atomic force microscope and scanning electron microscope.

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Tin–zinc alloy electrodeposition from aqueous citrate baths

Cited by 32 publications

References 14 publications

Effect of Sodium Bromide on the Electrodeposition of Sn, Cu, Ag and Ni from a Deep Eutectic Solvent-Based Ionic Liquid

Effect of Sodium Bromide on the Electrodeposition of Sn, Cu, Ag and Ni from a Deep Eutectic Solvent-Based Ionic Liquid

Early stages of wetting of copper by Sn–Zn eutectic alloy

Spectroscopic and Morphological Investigation of ZnSn Thin Films Obtained by Radio Frequency Cosputtering

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