2015
DOI: 10.1016/j.apsusc.2015.07.211
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Tin sulfide (SnS) nanostructured films deposited by continuous spray pyrolysis (CoSP) technique for dye-sensitized solar cells applications

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Cited by 36 publications
(17 citation statements)
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“…1. It was observed that at lower temperature (280ºC and 320ºC) the band gap was higher (1.8 eV and 1.78 eV) than generally reported 1.6 -1.75 eV for SnS film [10,11]. In addition, at higher temperature (440ºC) again high band gap (1.85 eV) was observed.…”
Section: Effect Of Substrate Temperaturementioning
confidence: 58%
“…1. It was observed that at lower temperature (280ºC and 320ºC) the band gap was higher (1.8 eV and 1.78 eV) than generally reported 1.6 -1.75 eV for SnS film [10,11]. In addition, at higher temperature (440ºC) again high band gap (1.85 eV) was observed.…”
Section: Effect Of Substrate Temperaturementioning
confidence: 58%
“…Oxygen and carbon peaks may cause from the surface contamination. 23 Sn 3d exhibits two distinct peaks belong to Sn 3d 5/2 and Sn 3d 3/2 that are detected at 487.38 eV and 495.82 eV, respectively ( Figure 2B). The difference between these two peaks is 8.44 eV which is in agreement with the literature.…”
Section: Resultsmentioning
confidence: 99%
“…The difference between these two peaks is 8.44 eV which is in agreement with the literature. 23,24 The binding energies of the Sn 3d 5/2 and Sn 3d 3/2 peaks cannot be related to the values of elemental Sn (0) ortin in other phases of Sn x S y , but can be assigned to Sn 2+.23 No secondary phases, for instance SnS 2 with the ionic state of Sn 4+ , were detected that is placed at the binding energy at 485.5 eV. 23,24 The peak located at 162.8 eV could be assigned to the binding energies of the S 2− of SnS ( Figure 2C).…”
Section: Resultsmentioning
confidence: 99%
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“…SnS films have been deposited by various techniques such as atomic layer deposition [14], chemical bath deposition [15], hydrothermal method [16], mechanochemical route [17], silar method [18], spray pyrolysis [19], electron beam evaporation [20], sputtering [21], electrodeposition [1,12,22,23] and vacuum evaporation [4]. Among these techniques, electrodeposition is simple, inexpensive and convenient for large area deposition.…”
Section: Introductionmentioning
confidence: 99%