Time-Resolved Digital Image Correlation in the Scanning Electron Microscope for Analysis of Time-Dependent Mechanisms

Stinville, J.C.; Francis, Toby; Polonsky, Andrew; Torbet, Chris; Charpagne, Marie-Agathe; Chen, Z.; Balbus, Glenn H.; Bourdin, François; Valle, Valéry; Callahan, Patrick G.; Echlin, McLean P.; Pollock, Tresa M.

doi:10.1007/s11340-020-00632-2

Cited by 18 publications

(7 citation statements)

References 46 publications

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“…Stinville et al [116] proposed even a new method based also on the H-DIC for time-resolved DIC. With this method, it is possible to capture the evolution of both strain fields and strain localizations during deformation at the time scale from seconds to hours.…”

Section: Dic and Ommentioning

confidence: 99%

Review on Strain Localization Phenomena Studied by High‐Resolution Digital Image Correlation

Weidner

Biermann

2021

Adv Eng Mater

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She studied Materials Science in Freiberg and received her doctorate and habilitation. Her primary research interests focus on plasticity, fatigue, and related microstructural analysis of materials. Her particular interests are related to the application of complementary in situ characterization techniques for better understanding of kinetics of deformation and damage processes. To date she has authored or coauthored over 100 peer-reviewed publications.

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Section: Dic and Ommentioning

confidence: 99%

Review on Strain Localization Phenomena Studied by High‐Resolution Digital Image Correlation

Weidner

Biermann

2021

Adv Eng Mater

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“…The variability in HR-DIC measurements is evaluated using the procedure described in refs. [14,18]. The strain vari-ability is obtained using multiple pairs of images acquired at an identical position without deformation using the image condition described in the previous section.…”

Section: Variability In Hr-dic Measurementsmentioning

confidence: 99%

“…In addition, complex loading conditions such as cyclic, biaxial, or high-temperature loading [10][11][12] can be applied, while HR-DIC can still be performed. Moreover, this technique is especially adapted for multi-modal and cor-relative measurements [12,13] and dynamic measurements [14] allowing for microstructure-mechanical property relationship identification. Significant efforts in the past decade have been made to improve HR-DIC measurements.…”

Section: Introductionmentioning

confidence: 99%

“…The development of robust nanometer-scale patterning techniques has significantly improved the reliability, sensitivity, and resolution of the HR-DIC measurements [16][17][18]. In parallel, the effect of scanning electron imaging on HR-DIC measurements has been detailed [17,18] and SEM spatial and drift distortion minimized [14] to improve the resolution of the measurements. More recently, automation in image acquisition and mechanical testing [14] via scripting has facilitated the acquisition of HR-DIC meas-urements over a wide field of view.…”

Section: Introductionmentioning

confidence: 99%

“…In parallel, the effect of scanning electron imaging on HR-DIC measurements has been detailed [17,18] and SEM spatial and drift distortion minimized [14] to improve the resolution of the measurements. More recently, automation in image acquisition and mechanical testing [14] via scripting has facilitated the acquisition of HR-DIC meas-urements over a wide field of view. However, one of the main drawbacks of the HR-DIC measurements under SEM is the acquisition time.…”

Section: Introductionmentioning

confidence: 99%

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High-Throughput High-Resolution Digital Image Correlation Measurements by Multi-Beam SEM Imaging

et al. 2023

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Background Recent improvements in spatial resolution and measurement sensitivity for high-resolution digital image correlation (HR-DIC) now provide an avenue for the quantitative measurement of deformation events and capturing the physical nature of deformation mechanisms. However, HR-DIC measurements require significant time due to scanning electron image acquisition; such a limitation prevents the widespread use of HR-DIC for material characterization. Objective Apply a novel SEM acquisition technology to enhance HR-DIC measurements for high throughput applications. Methods Multi-beam SEM technology is employed to image an entire gauge length at once at high resolution and at nearly a hundredfold acceleration of typical HR-DIC image acquisition, even when automated stage movement and image acquisition are employed. These images were fed into a discontinuity-tolerant HR-DIC software to determine slip localization induced by non-metallic inclusions and grain structure. Results Slip localization was able to be analyzed to an unprecedented level, with over 210,000 slip bands able to be investigated, with the most intense slip localizing near and parallel to twin boundaries and in the vicinity of non-metallic inclusion clusters. Additionally, secondary slip activation and grain boundary shearing by intense dislocation pileups are observed to reduce slip amplitude near and parallel to twin boundaries. Conclusions By performing HR-DIC in conjunction with a multi-beam SEM, high-throughput measurements of large fieldof-view, high-resolution images were able to be performed in a timely manner. These measurements provided an immense number of slip events for statistical analysis to be performed on to relate to microstructural features.

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Using the Ti–Al System to Understand Plasticity and Its Connection to Fracture and Fatigue in α Ti Alloys

Pagan

Peterson

Shade

et al. 2023

Metall Mater Trans A

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Time-Resolved Digital Image Correlation in the Scanning Electron Microscope for Analysis of Time-Dependent Mechanisms

Cited by 18 publications

References 46 publications

Review on Strain Localization Phenomena Studied by High‐Resolution Digital Image Correlation

Review on Strain Localization Phenomena Studied by High‐Resolution Digital Image Correlation

High-Throughput High-Resolution Digital Image Correlation Measurements by Multi-Beam SEM Imaging

Using the Ti–Al System to Understand Plasticity and Its Connection to Fracture and Fatigue in α Ti Alloys

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