Time Dependence Investigation of the Electrical Resistance of Au / Au Thin Film Micro Contacts

Duvivier, Pierre-Yves; Mandrillon, Vincent; Inal, Karim; Dieppedale, C.; Deldon-Martoscia, Sophie; Polizzi, Jean-Philippe

doi:10.1109/holm.2010.5619563

Cited by 7 publications

(18 citation statements)

References 19 publications

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“…To compare our work to [4][5][6][7][8][9][10], ECR is measured using a Nanoindenter XP which experimental setup reproduces MEMS ohmic switch contact [13] (from 100 µN to 1 mN applied loads under 1 mA).…”

Section: Electrical Contact Resistancementioning

confidence: 99%

“…Diop [25] and P.-Y. Duvivier [13] is used for studying ECR by reproducing microswitches geometry. The test structure is constituted by micro bars that are flat on one side and provided with tens of aligned spherical micro bumps on the other one.…”

Section: Electrical Contact Resistancementioning

confidence: 99%

“…The ECR is measured using 4 probes technique. Figure 9: Experimental setup reproducing MEMS ohmic switch contact using a Nano-indenter XP with a zoom on two contacting test specimens [13].…”

Section: Electrical Contact Resistancementioning

confidence: 99%

“…To respect time dependence, the same procedure as [13] is applied and consists of performing measurements of ECR over a long period (5000 s) under constant load. The complete test sequence is presented Fig.…”

Section: Electrical Contact Resistancementioning

confidence: 99%

“…To compare our work to [4][5][6][7][8][9][10], hardness (section 2) and ECR [13] (section 4) are measured using a Nanoindenter XP. To understand hardening mechanisms and the difference between the two species in hardness increase, a microstructural analysis is performed (section 3).…”

Section: Introductionmentioning

confidence: 99%

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Investigation of boron and nitrogen ion beam implantation in gold thin films for ohmic MEMS switch contact improvement

Arrazat

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2013 Transducers &Amp; Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems

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Section: Electrical Contact Resistancementioning

confidence: 99%

Section: Electrical Contact Resistancementioning

confidence: 99%

Section: Electrical Contact Resistancementioning

confidence: 99%

Section: Electrical Contact Resistancementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Investigation of boron and nitrogen ion beam implantation in gold thin films for ohmic MEMS switch contact improvement

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Development of a multifunctional nanoindenter integrated in-situ Scanning Electron Microscope - application to the monitoring of piezoresponse and electro-mechanical failures

et al. 2021

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Resistive-nanoindentation on gold: Experiments and modeling of the electrical contact resistance

Volpi

Rusinowicz

Comby-Dassonneville

et al. 2021

Review of Scientific Instruments

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This paper reports the experimental, analytical and numerical study of resistive-nanoindentation tests performed on gold samples (bulk and thin film). First the relevant contributions to electrical contact resistance are discussed and analytically described. A brief comparison of tests performed on gold and on natively-oxidized metals highlights the high reproducibility and the voltage-independence of experiments on gold (thanks to its oxide-free surface). Then the evolution of contact resistance during nanoindentation is fully explained in terms of electronic transport regimes: starting from tunneling, electronic transport is then driven by ballistic conduction before ending with pure diffusive conduction. The corresponding analytical expressions, as well as their validity domains, are determined and compared with experimental data, showing excellent agreement. From there, focus is made on the diffusive regime.Resistive-nanoindentation outputs are fully described by analytical and finite-element modeling. The developed numerical framework allows a better understanding of the main parameters: it first assesses the technique capabilities (validity domains, sensitivity to tip defect, sensitivity to rheology, effect of an oxide layer,…), but it also validates the different assumptions made on current line distribution. Finally it is shown that a simple calibration procedure allows a well-resolved monitoring of contact area during resistive-nanoindentation performed on samples with complex rheologies (ductile thin film on elastic substrate).Comparison to analytical and numerical approaches highlights the strength of resistivenanoindentation for continuous area monitoring.

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Time Dependence Investigation of the Electrical Resistance of Au / Au Thin Film Micro Contacts

Cited by 7 publications

References 19 publications

Investigation of boron and nitrogen ion beam implantation in gold thin films for ohmic MEMS switch contact improvement

Investigation of boron and nitrogen ion beam implantation in gold thin films for ohmic MEMS switch contact improvement

Development of a multifunctional nanoindenter integrated in-situ Scanning Electron Microscope - application to the monitoring of piezoresponse and electro-mechanical failures

Resistive-nanoindentation on gold: Experiments and modeling of the electrical contact resistance

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