Tightly Compacted Perovskite Laminates on Flexible Substrates via Hot-Pressing

Abstract

Pressure and temperature are powerful tools applied to perovskites to achieve recrystallization. Lamination, based on recrystallization of perovskites, avoids the limitations and improves the compatibility of materials and solvents in perovskite device architectures. In this work, we demonstrate tightly compacted perovskite laminates on flexible substrates via hot-pressing and investigate the effect of hot-pressing conditions on the lamination qualities and optical properties of perovskite laminates. The optimized laminates achieved at a temperature of 90 °C and a pressure of 10 MPa could sustain a horizontal pulling pressure of 636 kPa and a vertical pulling pressure of 71 kPa. Perovskite laminates exhibit increased crystallinity and a crystallization orientation preference to the (100) direction. The optical properties of laminated perovskites are almost identical to those of pristine perovskites, and the photoluminescence quantum yield (PLQY) survives the negative impact of thermal degradation. This work demonstrates a promising approach to physically laminating perovskite films, which may accelerate the development of roll-to-roll printed perovskite devices and perovskite tandem architectures in the future.

Impact of Pressure and Temperature on the Compaction Dynamics and Layer Properties of Powder-Pressed Methylammonium Lead Halide Thick Films

“…From the XRD patterns of our hot-pressed MAPbI 3 thick films, the temperature dependence of the intensity ratio of the peaks associated with perpendicular crystal planes could be observed (see Figure b). This clearly indicates that the sintering process induces a preferential orientation in the thick films and thus recrystallization occurs …”

“…This clearly indicates that the sintering process induces a preferential orientation in the thick films and thus recrystallization occurs. 40…”

Lamination methods for the fabrication of perovskite and organic photovoltaics

“…Moreover, this method possesses high operational capability through the parallel preparation of the top and bottom layers, adopting the conventional layer-by-layer deposition methods. [54][55][56][57] Initially, the lamination method was used to implement carbon nanotubes (CNTs) as a bifunctional hole transporter and back contact layer onto the PSC configuration. 58 For a favored back contact in PSC architecture, one should consider the energy/ range, electrical conductivity, and stability of the fabricated electrodes.…”