Through-Wafer Optical Interconnects For Multi-Wafer Wafer-Scale Integrated Architectures

Hornak, L.A.; Tewksbury, Stuart K.; Ligtenberg, A.; Sugla, B.; Franzon, Paul D.

doi:10.1117/12.939568

Cited by 4 publications

(3 citation statements)

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“…At board level this is based on a throughboard optical interconnect scheme [1,2] although in many areas the analysis is applicable to guided wave schemes [3,4] also. The lasers considered are InGaAsP devices, single ended with 20% incremental quantum efficiency and lengths of 200 tm, emitting in the 1.55 jim region.…”

Section: Optical Modelmentioning

confidence: 99%

“…This has been modelled by calculating the transfer function down a lossy transmission line for each of the Fourier components of a pulse train and then reconstituting the output waveform. This frequency domain analysis has been chosen in preference to a time domain approach such as SPICE [8] (1) where V is the input voltage to the line, V the output voltage and y is the propagation constant:…”

Section: Latencymentioning

confidence: 99%

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Comparison of optical and electrical data interconnections at the board and backplane levels

Ayliffe¹,

Parker²,

Robinson³

1990

SPIE Proceedings

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The benefits of optical interconnections over distances of hundreds of metres or more are well established. However, the increasing complexity of computers and other electronic equipment places severn demands on interconnection capabilities over much shorter distances where optics can also offer potential advantages. A comparison of optical and electrical interconnects at the board and backplane levels of modem mainframe computers has been performed using the interconnect criteria appropriate at these levels. For example, within the CPU (central processor unit) the most important criterion is latency. In electrical interconnections this arises from a combination of the propagation time together with signal distortion caused by the frequency dependent attenuation characteristic of the transmission line and reflections from terminations, vias and other discontinuities. This gives latencies which increase supralinearly with increasing line length. The optical signal, however, propagates faster and has no frequency dependent delay, but a length independent delay is incurred in the electrical/optical interfaces, setting a lower limit on the distance over which optics offers an advantage. This trade-off is examined. Power consumption and interconnect density are also compared.Optical backplane geometries allowing unrestricted bi-directional connections (ie. any point to any other point) are less well defined, but a comparison has been made of one particular geometry based on a wideband bus consisting of up to eight nodes, each operating at 32 Gb/s.

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Section: Optical Modelmentioning

confidence: 99%

Section: Latencymentioning

confidence: 99%

Comparison of optical and electrical data interconnections at the board and backplane levels

Ayliffe¹,

Parker²,

Robinson³

1990

SPIE Proceedings

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“…We observe that the above analysis for two dimensions leads to O(Ne) and f(N e log -2 N) volumes for the binary n-cube and the cube-connected cycles, respectively. 4. It can be even worse, namely, in [6], [12] it is shown that we cannot always assume that a unit length of wire has O(1) volume (for instance, if we want to drive the signals to very high speed on chip).…”

Section: Yields An Upper Bound L(n) < 4n4/3 Togethermentioning

confidence: 99%

Locality, Communication, and Interconnect Length in Multicomputers

Vitányi¹

1988

SIAM J. Comput.

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We derive a lower bound on the average interconnect (edge) length in d-dimensional embeddings of arbitrary graphs, expressed in terms of diameter and symmetry. It is optimal for all graph topologies we have examined, including complete graph, star, binary n-cube, cube-connected cycles, complete binary tree, and mesh with wraparound (e.g., torus, ring). The lower bound is technology independent, and shows that many interconnection topologies of today's multicomputers do not scale well in the physical world (d 3). The new proof technique is simple, geometrical, and works for wires with zero volume, e.g., for optical (fibre) or photonic (fibreless, laser) communication networks. Apparently, while getting rid of the "yon Neumann" bottleneck in the shift from sequential to nonsequential computation, a new communication bottleneck arises because of the interplay between locality of computation, communication, and the number of dimensions of physical space. As a consequence, realistic models for nonsequential computation should charge extra for communication, in terms of time and space.

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