Abstract:There is a need for miniaturizing electronic components such as ICs and modules that are used in pottable devices like cellular phones and PDAs. Miniaturization not only results in a reduced foot print of the components on the printed board but it can also have a positive effect on the device performance. The ultimate miniaturization is reached when packaging the component into a Chip Size Package (CSP). To enable this the bonding pads of ICs can be rerouted into, e.g., a Ball Grid Array (BGA) configuration.Fo… Show more
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