Abstract:Purpose -The substrate coupling and loss in integrated circuits are analyzed. Then, the authors extract impedances between any numbers of embedded contacts. The paper aims to discuss these issues. Design/methodology/approach -The paper proposes a new substrate network 3D extraction technique, adapted from a transmission line method or Green kernels, but in the whole volume. Findings -Extracting impedances between any numbers of embedded contacts with variable shapes or/and through silicon via. This 3D method i… Show more
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