Through silicon via filling methods with metal/polymer composite for three-dimensional LSI

Abstract

The novel use of metal/polymer composite can be a new candidate for filling through silicon vias (TSV) for three-dimensional (3D) LSI, as it provides a much faster and inexpensive fabrication process compared to copper electroplating. In this study, different process methods have been tested in order to optimize TSV filling with Ag/polypyrrole composite. All together nine method set-ups have been examined to analyse their average filling ratios. The statistical analysis of the techniques showed that the masking and scratching in vacuum environment proved to be the most effective, in average up to 98% filling ratio could be reached within 5 min. The technological differences of the two techniques to remove the additional deposited composite material on the surface caused by the wet dipping in aspect of the resulting via fillings are also detailed in this paper. The use of these techniques can contribute to improve through-put for production of 3D-LSI with metal/polymer composites.

Extrusion Suppression of TSV Filling Metal by Cu-W Electroplating for Three-Dimensional Microelectronic Packaging

“…However, there are problems of shrinkage or partial filling and polymer may degrade over time. [25,26] Recently, SiC-based and Bi-Sn-Ag solders have been tested for the TSV filling. However, extrusion properties are not discussed.…”

Low-Dimensional Materials for Disruptive Microwave Antennas Design

“…The key performance of TSVs is determined by the filling materials used in the silicon via. There are various materials that have been used for the TSV, such as tungsten (W), copper (CU) [28,29] and a Ag/polypyrrole composites [30]. The copper is the most commonly used filling material for TSV due to its excellent electrical conductivity and low process costs.…”

Removing Gas from a Closed-End Small Hole by Irradiating Acoustic Waves with Two Frequencies

“…For example, Lin et al demonstrated the vacuum filling of complex microchannels with liquid metal [7]. Unfortunately, these two methods require a pressure vessel and additional work such as pressurization and depressurization [8][9][10]. Thus, more efficient methods are required.…”