Through-Silicon Photonic Via and Unidirectional Coupler for High-Speed Data Transmission in Optoelectronic Three-Dimensional LSI

Noriki, Akihiro; Lee, Kangwook; Bea, J. C.; Fukushima, T.; Tanaka, Tetsu; Koyanagi, Mitsumasa

doi:10.1109/led.2011.2174608

Cited by 22 publications

(8 citation statements)

References 9 publications

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“…An optical grating coupler with a mirror was used to change the propagation direction of the optical signal. A high coupling efficiency of more than 80% in this optical grating coupler has been obtained [47]. Continuous propagation of optical signal from vertical TSPV to horizontal Si waveguide through the optical grating coupler has been confirmed.…”

Section: D-stacked Cmos Image Sensormentioning

confidence: 63%

Recent progress in 3D integration technology

Koyanagi

2015

IEICE Electron. Express

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3D integration technology is the key for future LSIs with highperformance, low-power and multi-functionality. Especially, to mitigate various concerns caused by device scaling down to 10 nm or less, it is indispensable to introduce a new concept of heterogeneous 3D integration in which various kinds of materials, devices and technologies are integrated on a Si substrate. Future prospects of such a heterogeneous 3D integration technology has been discussed representing typical examples of heterogeneous 3D LSIs after the present situation of 3D integration technology is described.

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Section: D-stacked Cmos Image Sensormentioning

confidence: 63%

Recent progress in 3D integration technology

Koyanagi

2015

IEICE Electron. Express

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“…Placing laser sources in a top layer will minimize the influence of the temperature fluctuation of the bottom processor layer to the laser layer [21]. The interconnection of the laser source layer and the photonic network layer is achieved by TSPVs [24], [25]. The connection between the logic layer and the optical network layer is an electrical signal, and the electrical signal performs O/E, E/O conversion at the optical network layer.…”

Section: System Integration and Configurationmentioning

confidence: 99%

A Group-Based Laser Power Supply Scheme for Photonic Network on Chip

Wang

Yang

et al. 2019

IEEE Photonics J.

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It is expected that the future multicore systems will significantly benefit from photonic interconnect technology because of its large bandwidth. However, the static power consumed by laser sources accounts for a large proportion of the overall power budget; thus, it has a negative impact on the performance of future photonic network on chip. In this paper, GLaP, a group-based static laser power supply approach is proposed. The communication backbone is investigated based on single-write-multiread crossbar. Generic laser power delivery and allocation architectures are proposed to match the bandwidths with the requirements of different nodes. The laser sources are shared across the network which enables significant reduction in laser power consumption. The evaluation results show that the laser power can be significantly saved compared with traditional laser supply schemes.

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“…6). 27) Figure 4 shows a 3-D heterogeneous opto-electronic integrated module using 2.5-D Si interposer. Image sensor stacked on ADC chip is for high-performance image-processing.…”

Section: -D Heterogeneous Opto-electronics Integration Technologymentioning

confidence: 99%

3-D Hetero-Integration Technologies for Multifunctional Convergence Systems

Lee¹

2015

Journal of the Microelectronics and Packaging Society

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Since CMOS device scaling has stalled, three-dimensional (3-D) integration allows extending Moore`s law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. 3-D integration has many benefits such as increased multi-functionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, because it vertically stacks multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip. Anticipated applications start with memory, handheld devices, and high-performance computers and especially extend to multifunctional convengence systems such as cloud networking for internet of things, exascale computing for big data server, electrical vehicle system for future automotive, radioactivity safety system, energy harvesting system and, wireless implantable medical system by flexible heterogeneous integrations involving CMOS, MEMS, sensors and photonic circuits. However, heterogeneous integration of different functional devices has many technical challenges owing to various types of size, thickness, and substrate of different functional devices, because they were fabricated by different technologies. This paper describes new 3-D heterogeneous integration technologies of chip self-assembling stacking and 3-D heterogeneous opto-electronics integration, backside TSV fabrication developed by Tohoku University for multifunctional convergence systems. The paper introduce a high speed sensing, highly parallel processing image sensor system comprising a 3-D stacked image sensor with extremely fast signal sensing and processing speed and a 3-D stacked microprocessor with a self-test and self-repair function for autonomous driving assist fabricated by 3-D heterogeneous integration technologies.

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Through-Silicon Photonic Via and Unidirectional Coupler for High-Speed Data Transmission in Optoelectronic Three-Dimensional LSI

Cited by 22 publications

References 9 publications

Recent progress in 3D integration technology

Recent progress in 3D integration technology

A Group-Based Laser Power Supply Scheme for Photonic Network on Chip

3-D Hetero-Integration Technologies for Multifunctional Convergence Systems

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