1999
DOI: 10.1149/1.1391966
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Through‐Mask Electrochemical Micromachining of Titanium

Abstract: Through-mask electrochemical micromachining (EMM) involves high speed selective metal dissolution from unprotected areas of a photoresist-patterned workpiece that is made an anode in an electrolytic cell. Compared to chemical etching, electrochemical dissolution offers higher rates and better control on a micro-and macro-scale of shape and surface texture of anodically dissolved materials. 1,2 EMM is receiving considerable attention in the electronics industry for thin film patterning. 3 In recent years, there… Show more

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Cited by 86 publications
(80 citation statements)
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References 24 publications
(39 reference statements)
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“…Both the width and depth of the groove increased with electrochemical etching time, and the increasing rate of the width slightly decreased with the etching time, whereas the depth increased linearly. This asymmetry dissolution effect has already been reported in experiments and a simulation of electrochemical bulk micromachining with a photoresist mask [29]. In this report, the opening of the resist mask was smaller than the final groove width due to undercutting, similar to our experiments.…”
Section: Resultssupporting
confidence: 91%
See 1 more Smart Citation
“…Both the width and depth of the groove increased with electrochemical etching time, and the increasing rate of the width slightly decreased with the etching time, whereas the depth increased linearly. This asymmetry dissolution effect has already been reported in experiments and a simulation of electrochemical bulk micromachining with a photoresist mask [29]. In this report, the opening of the resist mask was smaller than the final groove width due to undercutting, similar to our experiments.…”
Section: Resultssupporting
confidence: 91%
“…In fact, the changes of the grooves obtained by Fig. 7 agree with the experimentally measured and simulated etched profiles reported in the investigation [29]. It is noted again that the width and depth of the grooves formed by electrochemical etching increased with the etching time, as shown in Fig.…”
Section: Resultssupporting
confidence: 87%
“…Mathematical problem.-The formulation of the mathematical problem describing the shape evolution during TMEMM has been presented in detail by West et al 39 and Madore et al 38 In the case of mass-transfer limited electrochemical dissolution, a tertiary current distribution can be presumed to govern the local etch rate along the metal surface, hence the influence of ohmic resistances and electrode kinetics can be neglected. In the absence of convective mass transfer and using a pseudo-steady state assumption for the relaxation of the concentration field (c), the convection-diffusion equation simplifies to yield the Laplace equation:…”
Section: Simulationmentioning
confidence: 99%
“…As the film's thickness lies on the order of nanometers, its presence can be neglected for the study of shape evolution during TMEMM. The experimental results were thus compared with a shape evolution model previously developed by Madore et al 38 for TMEMM of titanium, assuming that shape changes are determined by diffusive mass transfer only. The model was solved numerically using both a Boundary Element Method (BEM) and a Finite Element Method (FEM).…”
mentioning
confidence: 99%
“…This is performed in two ways, either by local insulation of one or both of the electrodes [20,21] or by making use of the ohmic potential drop in the electrolyte due to high Faradaic currents at high overpotentials. Both methods exist in various sophisticated modifications.…”
Section: Introductionmentioning
confidence: 99%