Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process

Kim, Bong Hoon; Lee, Jungyup; Won, Sang Min; Xie, Zhaoqian; Chang, Jan Kai; Yu, Yongjoon; Cho, Youn Kyoung; Jang, Hokyung; Jeong, Ji Yoon; Lee, Yechan; Ryu, Arin; Kim, Do Hoon; Lee, Kun Hyuck; Lee, Jong Yoon; Liu, Fei; Wang, Xueju; Huo, Qingze; Min, Seunghwan; Wu, Di; Ji, Bowen; Banks, Anthony; Kim, Jeonghyun; Oh, Nuri; Jin, Hyeong Min; Han, Seungyong; Kang, Daeshik; Lee, Chi Hwan; Song, Young Min; Zhang, Yihui; Huang, Yonggang; Jang, Kyung In; Rogers, John A.

doi:10.1021/acsnano.8b00180

Cited by 40 publications

(36 citation statements)

References 39 publications

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“…Utilizing such a promising method, the researchers manufactured more than 40 architectures, ranging from helices and flowers to frameworks, using different planar patterns, compressive strain, and bonding sites. The assembly buckling benefiting from a high compatibility is also capable of electronic devices, wearable devices, and plasmonic structures . The strategy of buckling was further reported by Fu et al for reconfigurable devices based on multistable mechanics.…”

Section: Strain‐induced Construction Of Mesostructured Nmsmentioning

confidence: 88%

Inorganic Stimuli‐Responsive Nanomembranes for Small‐Scale Actuators and Robots

Tian

Wang

Chen

et al. 2020

Advanced Intelligent Systems

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The term small‐scale robotics describes a wide variety of miniature robotic systems, ranging from millimeter‐sized devices down to autonomous mobile systems with dimensions measured in nanometers. These systems can perform complex tasks that are impossible for humans to accomplish or at scales that humans cannot reach. In recent years, the rapid advancement of small‐scale robotics has benefited from the progress in synthesis and nanotechnology, providing access to nanomembranes with stimuli‐responsive materials, such as phase transition materials, shape memory alloys, and palladium. These materials are 2D sheets with a thickness ranging from 5 to 500 nm, and they have the ability to change their shape reversibly under extremal stimuli. Together with strain engineering for deterministic assembly, various stimuli‐responsive actuators and robots have been fabricated for medicine, manufacturing, and exploration by endowing them with the combined features of a continuously deformable structure, remote operation, and several degrees of freedom. Herein, the recent achievements in small‐scale actuators and robots based on inorganic stimuli‐responsive nanomembranes are reviewed and their advantages and properties highlighted.

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Section: Strain‐induced Construction Of Mesostructured Nmsmentioning

confidence: 88%

Inorganic Stimuli‐Responsive Nanomembranes for Small‐Scale Actuators and Robots

Tian

Wang

Chen

et al. 2020

Advanced Intelligent Systems

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“…The simulation results showed that the Shape II has a much smaller radiant efficiency than Shape I for all three antennas. Figure a (iii) presents an array of Si nanomembrane nMOS transistors . The interconnected 3D bridge structures ensure the functional transistors undergo elastic and reversible deformations during the 2D‐to‐3D geometrical transformation.…”

Section: Buckling Assembly Methods and Applicationsmentioning

confidence: 99%

Section: Buckling Assembly Methods and Applicationsmentioning

confidence: 99%

Micro/Nanoscale 3D Assembly by Rolling, Folding, Curving, and Buckling Approaches

Zhang

2019

Advanced Materials

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The miniaturization of electronics has been an important topic of study for several decades. The established roadmaps following Moore's Law have encountered bottlenecks in recent years, as planar processing techniques are already close to their physical limits. To bypass some of the intrinsic challenges of planar technologies, more and more efforts have been devoted to the development of 3D electronics, through either direct 3D fabrication or indirect 3D assembly. Recent research efforts into direct 3D fabrication have focused on the development of 3D transistor technologies and 3D heterogeneous integration schemes, but these technologies are typically constrained by the accessible range of sophisticated 3D geometries and the complexity of the fabrication processes. As an alternative route, 3D assembly methods make full use of mature planar technologies to form predefined 2D precursor structures in the desired materials and sizes, which are then transformed into targeted 3D mesostructures by mechanical deformation. The latest progress in the area of micro/nanoscale 3D assembly, covering the various classes of methods through rolling, folding, curving, and buckling assembly, is discussed, focusing on the design concepts, principles, and applications of different methods, followed by an outlook on the remaining challenges and open opportunities.

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“…Here, we report a two‐stage sequence for introducing solid encapsulation materials on stretchable electronic systems, with wide applicability across the most advanced interconnect configurations, including 2D serpentine, 2D fractal‐inspired shapes, and 3D helical coils . This strategy forms the solid encapsulation while the electronic system is in a prestretched state, instead of the load‐free state adopted in conventional strategies.…”

Section: Introductionmentioning

confidence: 99%

A Generic Soft Encapsulation Strategy for Stretchable Electronics

Zhu

et al. 2019

Adv Funct Materials

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Recent progress in stretchable forms of inorganic electronic systems has established a route to new classes of devices, with particularly unique capabilities in functional biointerfaces, because of their mechanical and geometrical compatibility with human tissues and organs. A reliable approach to physically and chemically protect the electronic components and interconnects is indispensable for practical applications. Although recent reports describe various options in soft, solid encapsulation, the development of approaches that do not significantly reduce the stretchability remains an area of continued focus. Herein, a generic, soft encapsulation strategy is reported, which is applicable to a wide range of stretchable interconnect designs, including those based on twodimensional (2D) serpentine configurations, 2D fractal-inspired patterns, and 3D helical configurations. This strategy forms the encapsulation while the system is in a prestrained state, in contrast to the traditional approach that involves the strain-free configuration. A systematic comparison reveals that substantial enhancements (e.g., ≈6.0 times for 2D serpentine, ≈4.0 times for 2D fractal, and ≈2.6 times for 3D helical) in the stretchability can be achieved through use of the proposed strategy. Demonstrated applications in highly stretchable lightemitting diodes systems that can be mounted onto complex curvilinear surfaces illustrate the general capabilities in functional device systems.

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Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process

Cited by 40 publications

References 39 publications

Inorganic Stimuli‐Responsive Nanomembranes for Small‐Scale Actuators and Robots

Inorganic Stimuli‐Responsive Nanomembranes for Small‐Scale Actuators and Robots

Micro/Nanoscale 3D Assembly by Rolling, Folding, Curving, and Buckling Approaches

A Generic Soft Encapsulation Strategy for Stretchable Electronics

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