2002
DOI: 10.1063/1.1491301
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Three-dimensional imaging of a silicon flip chip using the two-photon optical-beam induced current effect

Abstract: We describe two- and three-dimensional imaging of a flip-chip silicon integrated circuit using backside optical probing and femtosecond two-photon excitation at a laser wavelength of 1.275 μm. Using a ×50 microscope objective, we typically achieved micron resolutions or better in both lateral and axial directions. Using axial scanning and a peak-detection algorithm we have demonstrated optical depth profiling across components on the chip.

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Cited by 37 publications
(18 citation statements)
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“…The details of the prescription used to design the correct s-SIL for imaging at a given sub-surface depth have already been discussed. In a further analogy with two-photon fluorescence microscopy, we have also shown that the TOBIC effect can provide a means of generating ultra-high 2D and, in addition, 3D resolved imaging because the generation of significant photocurrent only occurs within one confocal parameter of the focused spot [2,21,67,68]. The results are illustrated in Figures 12-14 below.…”
Section: Solid Immersion Lens Microscopy Using Tobic Imagingmentioning
confidence: 71%
“…The details of the prescription used to design the correct s-SIL for imaging at a given sub-surface depth have already been discussed. In a further analogy with two-photon fluorescence microscopy, we have also shown that the TOBIC effect can provide a means of generating ultra-high 2D and, in addition, 3D resolved imaging because the generation of significant photocurrent only occurs within one confocal parameter of the focused spot [2,21,67,68]. The results are illustrated in Figures 12-14 below.…”
Section: Solid Immersion Lens Microscopy Using Tobic Imagingmentioning
confidence: 71%
“…In our work we make use of this fact, together with the resolution enhancing capabilities of a solid immersion lens, to achieve unprecedented optical resolutions using incident radiation with a wavelength of 1.53 lm. In a further analogy with two-photon fluorescence microscopy, we showed in previous work that the TOBIC effect can provide a means of three-dimensionally resolved imaging [14][15][16] because the generation of significant photocurrent only occurs within one confocal parameter of the focused spot. The axial resolution provided is similar to that obtained through confocal imaging methods in which the double-pass of the imaging system improves its axial resolution [17].…”
Section: Tobic Microscopymentioning
confidence: 94%
“…Using a peak detection procedure it is possible to exploit the focal dependence of the two-photon signal to acquire depth-resolved images that reveal the axial extent of subsurface circuit features [14,15]. The ray tracing analysis described in Section 1 provides essential information for calibrating the depth-resolved images obtained in this way using an s-SIL.…”
Section: Extension To Nanometric 3d Imagingmentioning
confidence: 99%
“…However, to obtain depth resolution it is not enough to reach the buried interface and identify its contribution to the signal but the depth itself has to be measured. Use of two photon optical processes such as SHG or two-photon optical-beam-induced current [39,40] has permitted 3D imaging of circuit components in an integrated circuit with 1 mm lateral and 100 nm axial resolution. Differential confocal microscopy [41] has reached a depth resolution of 2 nm.…”
Section: Introductionmentioning
confidence: 99%