2019
DOI: 10.1038/s41928-019-0304-4
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Three-dimensional curvy electronics created using conformal additive stamp printing

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Cited by 135 publications
(129 citation statements)
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“…[ 134–136 ] Novel fabrication techniques, such as in‐mold printing, nonplanar stamp printing, or hydro dipping, also allow the high‐throughput deposition of inks onto nondevelopable surfaces using planar printing, and their integration with such advanced materials to obtain smart 4D structure is yet to be explored. [ 137–139 ] By combining novel structures and advanced fabrication strategies, we envision the development of various devices that are truly resilient, responsive and smart, such as sensors that can morph in response to the change in the subject, solar cells that can actively trace the direction of sunlight, or robots that can autonomously move, interact and transform, all fabricated using scalable, low‐cost and high‐throughput planar printing techniques. By addressing the current limitations and developing novel fabrication strategies, research on structural innovations in printed electronics is expected to have a significant impact on the making of nature‐inspired, resilient, autonomous, and multi‐stimuli responsive smart flexible devices.…”
Section: Discussionmentioning
confidence: 99%
“…[ 134–136 ] Novel fabrication techniques, such as in‐mold printing, nonplanar stamp printing, or hydro dipping, also allow the high‐throughput deposition of inks onto nondevelopable surfaces using planar printing, and their integration with such advanced materials to obtain smart 4D structure is yet to be explored. [ 137–139 ] By combining novel structures and advanced fabrication strategies, we envision the development of various devices that are truly resilient, responsive and smart, such as sensors that can morph in response to the change in the subject, solar cells that can actively trace the direction of sunlight, or robots that can autonomously move, interact and transform, all fabricated using scalable, low‐cost and high‐throughput planar printing techniques. By addressing the current limitations and developing novel fabrication strategies, research on structural innovations in printed electronics is expected to have a significant impact on the making of nature‐inspired, resilient, autonomous, and multi‐stimuli responsive smart flexible devices.…”
Section: Discussionmentioning
confidence: 99%
“…To achieve mechanical softness, one effective approach is to reduce the bending stiffness of electronics by making them thin: the bending stiffness of a structure is proportional to its thickness raised to the third power. [31] For example, brittle yet thin silicon (fracture limit of 1%) [32,33] with 100-nm thickness is mechanically flexible and can be bent while remaining intact. [34] In addition to imparting flexibility to electronic devices, they also require mechanical stretchability to better interface and concurrently deform with the skin.…”
Section: Strategies To Improve the Soft Electronics/skin Interfacementioning
confidence: 99%
“…[34] In addition to imparting flexibility to electronic devices, they also require mechanical stretchability to better interface and concurrently deform with the skin. Two strategies have been applied to achieve mechanical stretchability in soft electronics: 1) utilizing intrinsically stretchable, rubbery materials including rubbery electronic materials (semiconductors, conductors, and dielectrics) [14,15,24,[35][36][37][38][39][40][41][42][43][44][45] and liquid metals [46][47][48][49] to build the electronics; 2) employing engineered structures like wrinkles, [34,[50][51][52][53][54][55][56] serpentines, [12,17,33,44,[57][58][59][60][61] island-bridge structures, [62,63] textiles, [64] origami, [65,66] kirigami, [37,67] and microcracks [68] to accommodate the induced strain. [30,…”
Section: Strategies To Improve the Soft Electronics/skin Interfacementioning
confidence: 99%
“…Water-assisted transfer to nondevelopable surfaces has been widely used, but wrinkles and strains are inevitable (23). Conformal additive stamping method using an inflated balloon as the stamp has been invented as a very versatile transfer printing approach (24). However, during the printing step, the soft balloon surface has to stretch to fully conform to a 3D curvilinear target surface, which could induce nontrivial strains (>1%) in the devices as revealed in the paper.…”
Section: Introductionmentioning
confidence: 98%