Three-dimensional CFD simulation of the stencil printing performance of solder paste

Rusdi, Mohd Syakirin; Abdullah, M. Z.; Ishak, M. H. H.; Aziz, Mohd Yusmaidie; Abdullah, Moha Asri; Rethinasamy, P.; Jalar, Azman

doi:10.1007/s00170-020-05636-9

Cited by 9 publications

(6 citation statements)

References 16 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The conservation of momentum in a fluid is described by the Navier-Stokes Equations ( 2)-( 4), where v is the kinematic viscosity, and ρ is the fluid density [30][31][32][33].…”

Section: Mathematical Equationsmentioning

confidence: 99%

“…The coating material of the heat sink plays a critical role in enhancing the heat sink's performance. Various coating materials, such as carbon materials and SiO 2 [29], cupric oxide (CuO), silicon-based resin [30], carbon nanotube [31], copper-graphene [32], and phase-change materials [33], have been used on the coating of the heat sink surface. The heat sink coating can be achieved using the direct current electrodeposition technique, laser etching, and spraying.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Influence of Fin Thickness on the Thermal Performance and Selection of Coating Method for a Bus Duct Conductor

et al. 2022

View full text Add to dashboard Cite

This paper studies the fin thickness variation effect on a bus duct conductor’s thermal performance and the nanocomposite coating method selection for the bus duct conductor’s heat sink. ANSYS FLUENT was used to create a numerical model resembling the experimental setup. The IEC 60439-1 and IEC 60439-2 standards were used to benchmark the experimental data. The results revealed that the “chimney effect” induces an increment of the hot air adjacent to the heat sink. A conspicuous increase in the total heat transfer rate and fin effectiveness was observed as the fin thickness was reduced. This study revealed that s1 = 1 mm was the best fin thickness with 1.254 fin effectiveness, 1.862 W of total heat transfer rate, and 17.5 Nusselt number. Additionally, various coating methods were examined experimentally to select the best nanocomposite coating for the bus duct conductor’s heat sink. The ultrasonic agitation was the best coating method, which resulted in the lowest average resistance (8.8 μΩ) and a better percentage of Ag (0.6%–2.5%) on the substrate surface. Thus, the current outcomes are expected to better comprehend the impact of fin thickness on thermal performance, as well as the selection of coating method for the bus duct conductor.

show abstract

“…The conservation of momentum in a fluid is described by the Navier-Stokes Equations ( 2)-( 4), where v is the kinematic viscosity, and ρ is the fluid density [30][31][32][33].…”

Section: Mathematical Equationsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Influence of Fin Thickness on the Thermal Performance and Selection of Coating Method for a Bus Duct Conductor

et al. 2022

View full text Add to dashboard Cite

show abstract

“…Stencil printing is the process of depositing solder paste on the printed circuit boards (PCBs) before component placement and reflow process in the surface mount technology (SMT) field. Many studies have been published on solder paste printing and improvements in printing [1][2][3][4][5]. Stencil printing is so crucial in SMT that the industry reports 52-71% of fine-pitch SMT defects related to the solder paste stencil printing process [6].…”

Section: Introductionmentioning

confidence: 99%

Effect of stencil wall aperture on solder paste release via stencil printing

Sunar

Bakar

Jalar

et al. 2022

J. Phys.: Conf. Ser.

Self Cite

View full text Add to dashboard Cite

Solder paste printing is a process by which the correct amount of solder paste is applied to the printed circuit board via a stencil. The solder release from the stencil printing process very much depends on the type of solder paste and stencil conditions such as the shape of the aperture, size, and thickness of the stencil. This paper investigates the stencil condition in particular the stencil wall aperture and its relationship to the solder release ability. In this work, two types of stencil wall openings A and B were used, which differ in a different ways of cutting to achieve the wall aperture. The cutting process produced different surface roughness of the wall aperture of the stencil. Stencil printing was performed to print the solder paste onto the PCB pad. The release of solder paste was observed by solder paste inspection (SPI) and analyzed qualitatively and quantitatively. The results show that stencil B gives a better solder compared to stencil A. This is due to the smoother wall aperture compared to stencil A which has a roughened wall aperture. This shows that the performance of stencil printing in terms of solder printing quality is highly dependent on the surface roughness of the stencil aperture. Stencil quality is important as it affects the performance of solder paste printing, and this process is mainly carried out in the electronics industry. Therefore, understanding stencil conditions is important for electronic technology that uses solder printing.

show abstract

“…Their method revealed solder paste characterization and rheological research, in conjunction with computational simulations, provide hitherto an unavailable insight into the stencil printing process mechanism. Rusdi et al [5] has created a three-dimensional (3D) computer simulation for estimating the amount of solder paste that is printed via stencil. The numerical simulation was performed by using a combination of cross viscosity model and volume of fluid (VOF) method.…”

Section: Introductionmentioning

confidence: 99%

Effects of Different Viscometer Test on Stencil Printing Process for CFD Simulation

Ishak

Rusdi

Abdullah

et al. 2021

Preprint

View full text Add to dashboard Cite

This study discusses the use of different spindle type for the testing of lead-free solder paste by using Computational Fluid Dynamics (CFD) simulation. The study focuses on measuring the volume of solder paste deposition on the solder pad. Parallel-plate (PP) and Cone-plate (CP) spindle were used with five different tests consist of different spindle type and setting. The Volume of Fluid (VOF) method was used for the simulation while Cross model was applied as viscosity model for the solder paste. SAC305 type 3 lead-free solder paste was used in this study as it is mostly popular used by the industries nowadays. The solder paste filled the volume under different squeegee speeds and aperture size was compared between experiments and simulations. For different squeegee speed, PP 0.5 mm gap obtained the lowest average discrepancy value between simulation and experimental results. At different aperture size, all test show similar trend line and about the same value of average discrepancy with CP1° while PP 0.5 mm gap showed the lowest average discrepancy. At small aperture volume, all tests performed shows similar value of filled volume except PP 0.5 mm which exhibit the lowest percentage difference when compared with the experimental values at a bigger aperture volume.

show abstract

Three-dimensional CFD simulation of the stencil printing performance of solder paste

Cited by 9 publications

References 16 publications

Influence of Fin Thickness on the Thermal Performance and Selection of Coating Method for a Bus Duct Conductor

Influence of Fin Thickness on the Thermal Performance and Selection of Coating Method for a Bus Duct Conductor

Effect of stencil wall aperture on solder paste release via stencil printing

Effects of Different Viscometer Test on Stencil Printing Process for CFD Simulation

Contact Info

Product

Resources

About