Three-Dimensional Amorphous Ni–Cr Alloy Printing by Electrochemical Additive Manufacturing

Abstract

Amorphous metals have wide applications, including those in various transducer and sensor devices, because of their extraordinary physical and chemical characteristics, excellent mechanical properties, and corrosion resistance. However, their intrinsic ultrahigh strength and frangibility limit their manufacturing. Herein, a microanode-guided electroplating (MAGE) method is introduced to fabricate three-dimensional microhelices of amorphous Ni–Cr alloys. In MAGE, a super-high strength electrical field (∼105 V m–1) was established by charging a few volts across a tiny electrode gap (approximately 100 μm). The current density of MAGE was 2 orders of magnitude higher than that of traditional thin-film electrochemical coating that undergoes kinetic control processes, favoring the amorphous phases. The morphology, composition, and physical properties of the micro Ni–Cr devices were also investigated, revealing the outstanding reduced Young’s modulus (165 GPa), hardness (8.21 GPa), and high-temperature Joule heating stability up to 1200 °C.

Oxygen Vacancy Transition in HfOx‐Based Flexible, Robust, and Synaptic Bi‐Layer Memristor for Neuromorphic and Wearable Applications

“…Apart from achieving stable synaptic switching, fabrication of memristors on polymers/plastic is very difficult and crucial in order to minimize cost toward green and wearable electronics. [ 7–9 ] The switching mechanism in a memristor depends mostly on the formation and rupturing of conductive filament (CF). The formation and rupturing of conductive filament switches the memristor to ON and OFF states, respectively.…”

Cu/Ni-NiOx Nanoparticles Distributed on Graphene as Catalysts for the Methanolysis of Ammonia Borane to Produce Hydrogen

“…In particular, there were obvious Ni diffraction peaks and no obvious NiO x diffraction peaks in the XRD patterns. Considering that the compounding reaction conditions were relatively mild, Ni may be crystalline and the NiO x NPs may be amorphous. , The attaching of Ni-NiO x NPs changed the plasmonic properties of Cu NPs as demonstrated in the ultraviolet–visible (UV–vis) diffuse reflectance spectra (DRS) shown in Figure b with localized surface plasmon resonance (LSPR) absorption peak blue-shifting from 623 to 578 nm and UV–vis absorbance spectra shown in Figure S2 with a similar blueshift trend …”

“…Considering that the compounding reaction conditions were relatively mild, Ni may be crystalline and the NiO x NPs may be amorphous. 40,41 The attaching of Ni-NiO x NPs changed the plasmonic properties of Cu NPs as demonstrated in the ultraviolet−visible (UV−vis) diffuse reflectance spectra (DRS) shown in Figure 1b with localized surface plasmon resonance (LSPR) absorption peak blueshifting from 623 to 578 nm and UV−vis absorbance spectra shown in Figure S2 with a similar blueshift trend. 42 Transmission electron microscopy (TEM) images of Cu@ Cu 2 O NPs (Hollow Cu 2 O NPs can be obtained by slowly oxidizing Cu NPs in air or selectively etching the Cu core of Cu@Cu 2 O in CHCl 3 , Figure S3.)…”

Flexible Oxide Thin Film Transistors, Memristors, and Their Integration

“…[ 54 ] Second, it has lower T g (120 °C [ 55 ] ) than PI reducing the applicability range. [ 43 ] A lower cost substrate alternative is PET (119£ per 300×300 mm film of ≈0.1 mm thickness [ 52 ] ), [ 56,57 ] which is compatible with numerous solvents such as ketones, ester hydrocarbon, some acids, alkalis on top of wet etch processes. [ 58 ] PET can support a wide range of modulus of elasticity (1.57–5.20 GPa), [ 33 ] corresponding to more control over its stiffness.…”