Three-axis MEMS Accelerometer for Structural Inspection

Barbin, Evgenii; Koleda, A N; Nesterenko, Tamara G.; Vtorushin, Sergey

doi:10.1088/1742-6596/671/1/012003

Cited by 3 publications

(2 citation statements)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The thermal stress analysis of the shielding electrode in the chip with a pressure sensor embedded in an accelerometer during operation is also discussed. Considering the general operating temperature for MEMS accelerometer and pressure sensor (Barbin et al , 2016; Wang and Chdavarapu, 2015), we applied a thermal loading from room temperature (25°C) to the operating temperature (90°C) to evaluate the effect of thermal stress in the heating-up process. Furthermore, the residual stress is considered in the thermal stress analysis to discuss its effect when the chip is under operation.…”

Section: Finite Element Analysismentioning

confidence: 99%

Stress analysis of shielding electrode in chip with pressure sensor embedded in accelerometer

Yeh

2019

View full text Add to dashboard Cite

Purpose Analysis of the thermal effects during the packaging process or in the actual operating environment is necessary to develop small monolithic integrated sensing chips with heterogeneous integration. The use of multiple layers and various materials in monolithic integrated sensing chips addresses the coefficient of thermal expansion (CTE) mismatch issue. The purpose of this study is to focus on the residual stress analysis of the shielding electrode, which is a metal film that prevents pull-in of proof-mass during anodic bonding in microelectromechanical system (MEMS) chips with pressure sensors embedded in an accelerometer. Design/methodology/approach The finite element model of the chip was built by the commercial software ANSYS, and the residual stress was evaluated during the die attachment process for the shielding electrode. Various shielding electrode materials and a proposed design with a keep-out zone to reduce the residual stress are discussed, with a focus on the relationship between the geometric parameters of the chip and the residual stress for copper shielding electrodes of different thicknesses. Findings The results of the finite element analysis showed that the use of polysilicon as a shielding electrode in the proposed design generated the lowest residual stress because of its low CTE. The maximum stresses in both of in-plane and out-of-plane directions in the finite element model were reduced by keep-out zone design for the proposed design of the copper shielding electrode, and had 11 times reduction in out-of-plane direction especially, according to the nonlinear analysis as the stress concentration point in the shielding electrode moved. Moreover, the design with a thinner shielding electrode, thinner glass substrate and higher CTE of the glass substrate also lowered the maximum von Mises stress. On the other hand, the stress level during the operating temperature, without considering residual stress, overestimated up to five times in the proposed design. Originality/value In this study, valuable suggestions are proposed for the design of chips with pressure sensors embedded in accelerometers.

show abstract

Section: Finite Element Analysismentioning

confidence: 99%

Stress analysis of shielding electrode in chip with pressure sensor embedded in accelerometer

Yeh

2019

View full text Add to dashboard Cite

show abstract

“…WSN coverage area can achieve several kilometers due to the messages forwarding from one element to another. The monitoring system includes different types of sensors installed on structural elements of a building with a view to detect both the physical (humidity and temperature) and force (static and dynamic loads) effects on their strength and deformation properties [9].…”

Section: Introductionmentioning

confidence: 99%

Method for calculating loads combination on a building using information measures

Chernetsova

Shishkin

2018

MATEC Web Conf.

View full text Add to dashboard Cite

A method for calculating loads combination on a building is considered using information measures of the connectivity of signals received from sensors of various physical nature, united in a wireless monitoring network. The method includes the definition of the most powerful information measure on the ensemble of process realizations with known a priori load data by the criterion of connectedness of time series. Then, based on the selected information measure, the connectivity of the signals for the ensemble of realizations of the random process of loads to the building from the network formed by the wireless monitoring data bank of time series is calculated. The volume of the data bank sufficient to make the correct decision about the combination of loads on the building with a predetermined error probability is calculated on the basis of a consistent criterion for the ratio of Wald probabilities. This method is easily algorithmized and can be used to develop an automated decision support system.

show abstract

A System for Positioning an Optical Tunnel Measuring Transducer of a Microoptoelectromechanical Micro-g Accelerometer

Barbin

Nesterenko

Koleda

et al. 2022

2022 IEEE 23rd International Conference of Young Professionals in Electron Devices and Materials (EDM)

View full text Add to dashboard Cite

Three-axis MEMS Accelerometer for Structural Inspection

Cited by 3 publications

References 1 publication

Stress analysis of shielding electrode in chip with pressure sensor embedded in accelerometer

Stress analysis of shielding electrode in chip with pressure sensor embedded in accelerometer

Method for calculating loads combination on a building using information measures

A System for Positioning an Optical Tunnel Measuring Transducer of a Microoptoelectromechanical Micro-g Accelerometer

Contact Info

Product

Resources

About