Thinfilm technologies to fabricate a linear microactuator

Föhse, M.; Kohlmeier, T.; Gatzen, H.H.

doi:10.1016/s0924-4247(01)00509-x

Cited by 11 publications

(6 citation statements)

References 2 publications

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“…4) where Ψ n are positive Gaussian random numbers that physically represent the stochastic variation of the stress during the turning process, and ϕ n are uniform random numbers that represent the disorientation of the grooves due to the rotation of the turning tool. These numbers leave the fractal dimension unchanged.…”

Section: Appendix a Annexementioning

confidence: 99%

“…Electrical resistivity and HF permeability are influenced by the surface topography even for low roughness [3]. For example, to minimize the air gap in linear actuators, the microactuator's surface needs a very low roughness [4] that prevents magnetic field interference [5]. Surface quality is of major interest for nanodisplacement sensors considered as mirror reflection [6] based * Corresponding author.…”

Section: Introductionmentioning

confidence: 99%

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Roughness characteristic length scales of micro-machined surfaces: A multi-scale modelling

Bigerelle

Gautier

Iost

2007

Sensors and Actuators B: Chemical

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is an open access repository that collects the work of Arts et Métiers ParisTech researchers and makes it freely available over the web where possible. AbstractThe MEMS structure integrity, their dynamic properties as well as their electrostatic characteristics, strongly depend on the achieved surfaces roughness produced by the micromachining process. It is therefore, not surprising that numerous works are devoted to propose relations between roughness and physical or mechanical properties in this field. Yet the issue is full of complexities since roughness parameters depend on the method used for their evaluation. This article introduces a new approach of the roughness characterization, based on the scaling analysis. Experimental results obtained on micro machined surfaces show that the range roughness amplitude depends on the scan length and that roughness amplitude follows three stages. The stage I is due to a smoothing effect of the surface induced by the tip radius of the profilometer, stage II presents a piecewise power-law roughness distribution until a critical length that characterises the fractal behaviour of the surface, and stage III is characterised by extreme values statistics. The fractal parameter, the extreme values estimators and the crossover between stages II and III are shown to be related to the micromachining process. As a result, an original probabilistic model based on the Generalized Lambda Distribution (GLD) is proposed to estimate the multi-scale roughness in the stage III. Finally, thanks to a Bootstrap protocol coupled with a Monte-Carlo simulation, the maximal roughness amplitude probability density function is estimated at a scale higher than the scanning length.

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Section: Appendix a Annexementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Roughness characteristic length scales of micro-machined surfaces: A multi-scale modelling

Bigerelle

Gautier

Iost

2007

Sensors and Actuators B: Chemical

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“…The SMA responds the temperature by changing their shape and generates force and displacement [2], [3]. The responses of the SMA can be generated by using electro-thermal energy.…”

Section: Introductionmentioning

confidence: 99%

“…The responses of the SMA can be generated by using electro-thermal energy. The SMA is inter-metallic alloys, so they can be driven by electrical current via Joule heating which is easy and efficient way [2], [3].…”

Section: Introductionmentioning

confidence: 99%

Lag-Lead Compensator for Shape Memory Alloy in Gripping Manipulation

Setiawan

2010

TELKOMNIKA

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“…[14] In addition, SU8 is well suited for building permanent electron-multiplying microstructures or for embedding and insulating metal flux guides and conductors. [15][16][17] SU8 has been used without being patterned in embedding applications, although it is further planarized by mechanical polishing. SU8 provides excellent abrasion resistance in these applications.…”

Section: Introductionmentioning

confidence: 99%

Kinetics of Cationic Photopolymerizations of UV‐Curable Epoxy‐Based SU8‐Negative Photoresists With and Without Silica Nanoparticles

Cho

Park

et al. 2006

Macro Materials & Eng

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Summary: This paper reports on the photocuring kinetics of protonic‐acid‐initiated cationic polymerizations of UV‐curable epoxy‐based SU8‐negative photoresist systems with and without silica nanoparticles, as assessed using photo‐DSC, FTIR spectroscopy, UV‐vis spectroscopy, and SEM. Photo‐DSC analysis using an autocatalytic kinetic model demonstrated that the cross‐link density and cure rate increased as the concentration of silica nanoparticles with surface silanol groups increased to 2.5 wt.‐%. This result was confirmed by FTIR spectroscopy, and suggests that the presence of silica nanoparticles of up to 2.5 wt.‐% promoted the cure conversion and cure rate of the UV‐curable hybrid organic/inorganic negative photoresists due to the synergistic effect of silica nanoparticles acting both as an effective flow or diffusion‐aid agent and as a proton‐donor cocatalyst during the cationic photopolymerization process. The decrease in the cross‐link density that occurred when the silica content was higher than 2.5 wt.‐% was attributed to aggregation between silica nanoparticles due to their high surface energy.SEM photograph at the film‐air interface of the UV‐cured hybrid organic/inorganic photoresist containing 10 wt.‐% silica nanoparticles.magnified imageSEM photograph at the film‐air interface of the UV‐cured hybrid organic/inorganic photoresist containing 10 wt.‐% silica nanoparticles.

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Thinfilm technologies to fabricate a linear microactuator

Cited by 11 publications

References 2 publications

Roughness characteristic length scales of micro-machined surfaces: A multi-scale modelling

Roughness characteristic length scales of micro-machined surfaces: A multi-scale modelling

Lag-Lead Compensator for Shape Memory Alloy in Gripping Manipulation

Kinetics of Cationic Photopolymerizations of UV‐Curable Epoxy‐Based SU8‐Negative Photoresists With and Without Silica Nanoparticles

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