Thin layer in situ XRD of electrodeposited Ag/Sn and Ag/In for low-temperature isothermal diffusion soldering

Au–Sn bonding material for the assembly of power integrated circuit module

“…[11,12], AgeIn Refs. [11,13], AgeSn [13e15], NieSn [15e17] and CueSn [17e20]. Gollas et al [13] used in situ X-ray diffraction measurements to monitor the phase evolution of thin electroplated AgeSn and AgeIn sandwich layers at various temperatures.…”

Phase transformation and fracture behavior of Cu/In/Cu joints formed by solid–liquid interdiffusion bonding

“…Through this method, low-temperature bonding process can be achieved by depositing highmelting-point metal and low-melting-point solder at bonding areas. After bonding, the joint would only contain high-melting-point intermetallic compounds and hence it can withstand high temperature during the subsequent reflowing process, which can reduce the risk of thermal mismatch problems [5][6][7][8].…”

“…The Ag-In joints consisting of single-phase Ag 2 In were obtained through the bonding process at 180°C for 40 min and the annealing process for 24 h at 120°C. Bernhard et al [5] have studied phase transformation mechanisms of Ag-Sn and Ag-In interconnections. They found that Ag 3 Sn firstly generated in Ag-Sn interconnections bonded at 320°C for 8 h. The phase transformation process from Ag 3 Sn to Ag 5 Sn was accomplished when bonding time reached to 60 min.…”

Reaction dynamics of diffusion soldering with the eutectic Au–Sn alloy on copper and silver substrates

“…In situ X-ray diffraction (XRD) is an integral method enabling the direct investigation of the intermetallic phase evolution in a macroscopic volume at elevated temperatures. Gollas at al [25]. have reported in situ XRD studies of Ag/Sn and Ag/In samples, emphasizing the identification of the intermetallic phases involved in the reaction.…”