Thin film joining for high-temperature performance of power semi-conductor devices

Takahashi, T.; Komatsu, Shuichi; Nishikawa, Hiroshi; Takemoto, Tadashi

doi:10.1016/j.microrel.2009.10.001

Cited by 8 publications

(3 citation statements)

References 23 publications

(33 reference statements)

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“…Only very recently, a novel design of nanostructured brazing filler materials was proposed (Ref [57][58][59][60][61][62][63][64][65][66][67][68][69][70], which exploits nanoeffects, like fast interfacial reaction kinetics, grain boundary wetting, and melting point depression by nano-confinement to realize brazing at reduced temperatures (as compared to the brazing temperature for the corresponding bulk brazing alloy).…”

Section: Interfaces In Materials Joints: a Historical Perspectivementioning

confidence: 99%

Interfacial Design for Joining Technologies: An Historical Perspective

Janczak‐Rusch

Kaptay

Jeurgens

2014

J. of Materi Eng and Perform

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This paper gives an historic perspective of the concept of ''Interfacial Design'' in joined (e.g. soldered, brazed, diffusion bonded) assemblies. During the course of history, the awareness grew that the interface in a material joint can be perceived at different length scales. With the continuing development of joining materials and technologies, it became evident that the performance of assemblies is critically dependent on the structure and composition of the multiple internal interfaces in the material joints. Resulting trends in the microstructural design of soldering, brazing, and other bonding materials by smart engineering of internal interfaces, as driven by increasingly complex technological requirements, are briefly addressed.

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Section: Interfaces In Materials Joints: a Historical Perspectivementioning

confidence: 99%

Interfacial Design for Joining Technologies: An Historical Perspective

Janczak‐Rusch

Kaptay

Jeurgens

2014

J. of Materi Eng and Perform

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“…For example, Au-, Zn-and Bi-based alloys have been investigated, but their widespread use is unlikely because of their inferior properties and high costs [2][3][4][5][6][7][8][9] . New joining process using thin films and sintering process using metal particles have also been proposed as solder alternatives [10][11][12][13][14][15] . Especially the sintering behavior of metallic nanoparticles has been exploited to write electronic circuits and join components to a substrate.…”

Section: Introductionmentioning

confidence: 99%

Shear strength of Cu-to-Cu joints using mixed Ag particle paste

Nishikawa

Niwa

2015

QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY

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The high-temperature joining process is a key technology for electronic components and assemblies of automotive and other high-temperature applications. Recently, focusing on a sintering behavior of metal particles, the joining process using metal particles has been proposed as a solder alternative to establish a new joining technology for high -temperature applications. In this study, microscale Ag particle pastes were experimentally applied and the effect of the addition of nanoscale particles into microscale particle pastes on C u-to-Cu joint has been studied to improve the shear strength of Cu -to-Cu joint using a microscale particle paste. Then, th e effect of bonding condition on the shear strength of Cu-to-Cu joint has been investigated. It was found that the shear strength of the joint using a 50/50 mixed paste was more than 20 MPa at 300 ºC for 600 s under joining pressure of 5 MPa in air.

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“…For example, Au-, Zn-and Bi-based alloys have been investigated for use as lead-free solder, but their widespread use is unlikely because of their inferior properties and high costs [1][2][3][4][5][6][7][8]. New joining processes involving thin film joining process using evaporated films and sintering process using particles have also been proposed as solder alternatives [9][10][11].…”

Section: Introductionmentioning

confidence: 99%

Effects of Joining Conditions on Joint Strength of Cu/Cu Joint Using Cu Nanoparticle Paste

Nishikawa¹,

Hirano²,

Takemoto³

et al. 2010

TOSURSJ

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High-temperature bonding, or joining, is a key technology for electronic component assembly and other hightemperature applications. Recently, focusing on the sintering behavior of nanoparticles, the joining process using a nanoparticle paste has been proposed as an alternative to soldering for high-temperature applications. In this study, Cu nanoparticle paste was used to join two Cu discs, and the effect of joining conditions on the joint strength of the Cu-to-Cu joint was investigated. Joining using Cu nanoparticle paste was successfully achieved, but the effect of joining conditions such as heating temperature and joining atmosphere on joint strength of the Cu-to-Cu joint was significant.

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Thin film joining for high-temperature performance of power semi-conductor devices

Cited by 8 publications

References 23 publications

Interfacial Design for Joining Technologies: An Historical Perspective

Interfacial Design for Joining Technologies: An Historical Perspective

Shear strength of Cu-to-Cu joints using mixed Ag particle paste

Effects of Joining Conditions on Joint Strength of Cu/Cu Joint Using Cu Nanoparticle Paste

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