Shear strength of Cu-to-Cu joints using mixed Ag particle paste

Abstract

The high-temperature joining process is a key technology for electronic components and assemblies of automotive and other high-temperature applications. Recently, focusing on a sintering behavior of metal particles, the joining process using metal particles has been proposed as a solder alternative to establish a new joining technology for high -temperature applications. In this study, microscale Ag particle pastes were experimentally applied and the effect of the addition of nanoscale particles into microscale particle pastes on C u-to-Cu joint has been studied to improve the shear strength of Cu -to-Cu joint using a microscale particle paste. Then, th e effect of bonding condition on the shear strength of Cu-to-Cu joint has been investigated. It was found that the shear strength of the joint using a 50/50 mixed paste was more than 20 MPa at 300 ºC for 600 s under joining pressure of 5 MPa in air.

Pressureless Bonding by Micro-Sized Silver Particle Paste for High-Temperature Electronic Packaging

“…20) Additionally, one of the authors has previously studied the effect of the mass fraction of micro-sized and nano-scale Ag particles on joint shear strength using mixed particle paste. 21) The results showed that the shear strength improved as the content of nano-scale Ag particles in mixed paste increased to 50 mass%, and then decreased. Thus, we used a maximum spherical particle content of 50 mass% in this experiment.…”