2017
DOI: 10.1016/j.jallcom.2017.09.076
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Thin film fabrication of upconversion lanthanide-doped NaYF4 by a sol-gel method and soft lithographical nanopatterning

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Cited by 29 publications
(11 citation statements)
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“…Then, a small portion of it was scooped with the end of a stainless‐steel pipe (diameter = 5 mm) and blown within a few seconds. The FOG thin films were patterned via a nanoimprinting process . A perfluoropolyether mold was pressed against the FOG film at 100 °C and held for 10 min.…”
Section: Methodsmentioning
confidence: 99%
“…Then, a small portion of it was scooped with the end of a stainless‐steel pipe (diameter = 5 mm) and blown within a few seconds. The FOG thin films were patterned via a nanoimprinting process . A perfluoropolyether mold was pressed against the FOG film at 100 °C and held for 10 min.…”
Section: Methodsmentioning
confidence: 99%
“…The proposed structure can be implemented by introducing UC material in the pre-defined air slots of the silicon layer using an atomic layer deposition [30] or growing amorphous silicon layer on the soft lithographically nanopatterned UC slot using the sol-gel method [31].…”
Section: Discussionmentioning
confidence: 99%
“…First, the SiO 2 master had height, diameter, and pitch of ≈1.2 µm, 650 nm and 1.0 µm (or 2.0 µm for triple printing) respectively. The SiO 2 master pattern was prepared via reactive ion etching process by using a layer of polystyrene beads and an underlying Al layer as an etch mask as described in detail in a previous report . A PDMS mold was fabricated by curing Sylgard 184 (Dow Corning) on the patterned SiO 2 master.…”
Section: Methodsmentioning
confidence: 99%