Thin film encapsulation of acceleration sensors using polysilicon sacrificial layers

Stahl, H.; Hoechst, A.; Fischer, F.; Metzger, Lars; Reichenbach, Ralf; Laermer, Franz; Kronmueller, S.; Breitschwerdt, K.G.; Gunn, R.; Watcham, S.; Rusu, Cristina; Witvrouw, Ann

doi:10.1109/sensor.2003.1217162

Cited by 12 publications

(6 citation statements)

References 4 publications

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“…[4] Dendritic material such as hyperbranched polymer has also been reported as a high etch rate dryrelease sacrificial layer allowing large-area and high aspect ratio release. [5] Another material polycrystalline silicon is commonly used as sacrificial layers and a dry fluorine-based (SF 6 ) plasma chemistry [6] or a gaseous phase of CIF 3 or XeF 2 [7] are reported as releasing processes. Surface modifier DDMS ((CH 3 ) 2 SiCl 2 ) for stiction-free polysilicon surfaces is reported.…”

Section: Introductionmentioning

confidence: 99%

A novel method for sacrificial layer release in MEMS devices fabrication

Shi¹,

Chen²,

Jing³

et al. 2010

Chinese Phys. B

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During the forming process of the free-standing structure or the functional cavity when releasing the high aspect ratio sacrificial layer, such structures tend to stick to the substrate due to capillary force. This paper describes the application of pull-in length conception as design rules to a novel 'dimpled' method in releasing sacrificial layer. Based on the conception of pull-in length in adhering phenomenon, the fabrication and releasing sacrificial layer methods using micro bumps based on the silicon substrate were presented. According to the thermal isolation performances of one kind of micro electromechanical system device thermal shear stress sensor, the sacrificial layers were validated to be successfully released.

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Section: Introductionmentioning

confidence: 99%

A novel method for sacrificial layer release in MEMS devices fabrication

Shi¹,

Chen²,

Jing³

et al. 2010

Chinese Phys. B

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“…By this technique hermetic encapsulation can be achieved by the fabrication and sealing of surface micromachined membranes covering the MEMS. By making the membrane thick enough or by using supports, plastic packaging can still be used as first-level packaging technique (Stahl et al 2003;Hochst et al 2004).…”

Section: Introductionmentioning

confidence: 99%

A new generic surface micromachining module for MEMS hermetic packaging at temperatures below 200 °C

et al. 2007

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This paper presents the different processing steps of a new generic surface micromachining module for MEMS hermetic packaging at temperatures around 180°C based on nickel plating and photoresist sacrificial layers. The advantages of thin film caps are the reduced thickness and area consumption and the promise of being a low-cost batch process. Moreover, sealing happens by a reflow technique, giving the freedom of choosing the pressure and atmosphere inside the cavity. Sacrificial etch holes are situated above the device allowing shorter release times compared to the state-of-the-art. With the so-called overplating process, small etch holes can be created in the membrane without the need of expensive lithography tools. The etch holes in the membrane have been shown to be sufficiently small to block the sealing material to pass through, but still large enough to enable an efficient release.

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“…Chips containing microelectromechanical system ͑MEMS͒ devices cannot be directly packaged in a plastic or ceramic package, the so-called first level package, since MEMS are often composed of fragile and/or mobile free-standing parts that can easily be damaged during dicing and assembly. 1 To avoid such a damage, MEMS devices have to be protected at the wafer level, before dicing. This is possible by the so-called zero-level packaging or wafer-level packaging techniques, 2 which are typically accomplished by wafer bonding.…”

mentioning

confidence: 99%

Fabrication of Porous Membranes for MEMS Packaging by One-Step Anodization in Sulfuric Acid

Rico

Bois

Witvrouw

et al. 2007

J. Electrochem. Soc.

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A nonlithographic fabrication method that exploits the pore structure of anodic aluminum oxide to fabricate alumina porous membranes for microelectromechanical system ͑MEMS͒ packaging is proposed. This method allows wafer level packaging of MEMS devices at low temperature. We report on initial experiments indicating the feasibility of the technique. Patterned porous alumina films are formed by anodizing aluminum films on wafer substrates using sulfuric acid electrolytes. The etching of the barrier layer through the porous membrane by a plasma using a CF 4 + O 2 gas mixture, and the evidence of pore opening required for the release of a sacrificial MEMS layer are presented.

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Thin film encapsulation of acceleration sensors using polysilicon sacrificial layers

Cited by 12 publications

References 4 publications

A novel method for sacrificial layer release in MEMS devices fabrication

A novel method for sacrificial layer release in MEMS devices fabrication

A new generic surface micromachining module for MEMS hermetic packaging at temperatures below 200 °C

Fabrication of Porous Membranes for MEMS Packaging by One-Step Anodization in Sulfuric Acid

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