Thin film encapsulation for organic light emitting diodes using a multi-barrier composed of MgO prepared by atomic layer deposition and hybrid materials

Kim, Eungtaek; Han, Yuncheol; Kim, Woohyun; Choi, Kyung Cheol; Im, Hyeon‐Gyun; Bae, Byeong‐Soo

doi:10.1016/j.orgel.2013.04.011

Cited by 90 publications

(42 citation statements)

References 19 publications

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“…The reliability of flexible organic light-emitting diodes (FOLEDs) is a major issue in the industry. [1][2][3] To realize the FOLEDs full commercial potential, the device requires protection with a high barrier thin-film encapsulation. In addition, the intrinsic stability of the entire system also needs to be considered, since it also affects the operating lifetime of the device.…”

Section: Introductionmentioning

confidence: 99%

P‐129: Zero‐Stress Thin‐film Encapsulation Method for Increasing the Intrinsic Stability of Flexible OLEDs

Jeong

Lim

Choi

2017

Symp Digest of Tech Papers

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Section: Introductionmentioning

confidence: 99%

P‐129: Zero‐Stress Thin‐film Encapsulation Method for Increasing the Intrinsic Stability of Flexible OLEDs

Jeong

Lim

Choi

2017

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“…The area of Ca thin films was 1 × 1 cm 2 . The barrier films deposited by ALD/MLD on clean PET substrates were adhered to the Ca samples by UV sealant as shown in the inset of Figure 4 [26]. The calculated WVTR changes for different films before and after the bending test were shown in Figure 5.…”

Section: Resultsmentioning

confidence: 99%

A flexible transparent gas barrier film employing the method of mixing ALD/MLD-grown Al2O3 and alucone layers

et al. 2015

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Atomic layer deposition (ALD) has been widely reported as a novel method for thin film encapsulation (TFE) of organic light-emitting diodes and organic photovoltaic cells. Both organic and inorganic thin films can be deposited by ALD with a variety of precursors. In this work, the performances of Al2O3 thin films and Al2O3/alucone hybrid films have been investigated. The samples with a 50 nm Al2O3 inorganic layer deposited by ALD at a low temperature of 80°C showed higher surface roughness (0.503 ± 0.011 nm), higher water vapor transmission rate (WVTR) values (3.77 × 10−4 g/m2/day), and lower transmittance values (61%) when compared with the Al2O3 (inorganic)/alucone (organic) hybrid structure under same conditions. Furthermore, a bending test upon single Al2O3 layers showed an increased WVTR of 1.59 × 10−3 g/m2/day. However, the film with a 4 nm alucone organic layer inserted into the center displayed improved surface roughness, barrier performance, and transmittance. After the bending test, the hybrid film with 4 nm equally distributed alucone maintained better surface roughness (0.339 ± 0.014 nm) and barrier properties (9.94 × 10−5 g/m2/day). This interesting phenomenon reveals that multilayer thin films consisting of inorganic layers and decentralized alucone organic components have the potential to be useful in TFE applications on flexible optical electronics.

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“…The S-H nanocomposite layer helps improve the flexibility of the TFE layer and increase the lag time of permeation. [14,15]. Finally, Ag is inserted to observe the difference in the heat dissipation effect by variation in the Ag thickness and presence of Ag film.…”

Section: Fabrication Of Thin Film Encapsulation Layer With Inserted Amentioning

confidence: 99%

P-96: Heat Transferable Thin Film Encapsulation Inserted Ag Thin Film to Improve Reliability of Flexible Displays

Kwon

Bae

et al. 2016

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In this study, thin film encapsulation (TFE) with an Ag thin film is proposed to improve the long-term reliability of flexible displays in terms of the barrier property, flexibility, and heat dissipation. By applying thin film encapsulation to bottom-emission organic light-emitting diodes (BEOLEDs) fabricated on glass, the lifetimes of OLED devices were improved, showing differences among TFE layers. The maximum temperatures measured from the backside of the glass substrate were 66.73, 64.15, 59.21 and 39.63 °C after the OLED was operated at a luminance of 10000 cd/m 2 , and an operational lifetime test results were remarkably consistent with the measurement results of infrared images. Efficient heat dissipation through thermally conductive TFE layers improved the OLED reliability in terms of lifetime.

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Thin film encapsulation for organic light emitting diodes using a multi-barrier composed of MgO prepared by atomic layer deposition and hybrid materials

Cited by 90 publications

References 19 publications

P‐129: Zero‐Stress Thin‐film Encapsulation Method for Increasing the Intrinsic Stability of Flexible OLEDs

P‐129: Zero‐Stress Thin‐film Encapsulation Method for Increasing the Intrinsic Stability of Flexible OLEDs

A flexible transparent gas barrier film employing the method of mixing ALD/MLD-grown Al2O3 and alucone layers

P-96: Heat Transferable Thin Film Encapsulation Inserted Ag Thin Film to Improve Reliability of Flexible Displays

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