Thin electroless Co(W,P) film growth on titanium–nitride layer modified by self-assembled monolayer

Malki, Maayan; Rozenblat-Raz, A.; Duhin, Alla; Inberg, Alexandra; Horvitz, Dror; Shacham‐Diamand, Yosi

doi:10.1016/j.surfcoat.2014.04.041

Cited by 10 publications

(7 citation statements)

References 47 publications

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Section: Elementsmentioning

confidence: 99%

“…EL CoW alloys containing P or B deposited from alkali metal-free baths find use as diffusion barriers for Cu circuitry in ICs. − EL deposition of these alloys is often made onto catalyzed aminosiloxane SAMs, which also possess barrier properties and promote plating selectivity. Malki et al have shown that 3D growth of CoWP alloys on Au NP-catalyzed aminosiloxane SAMs is influenced and controlled by the nature of the amine. Sukackienė and co-workers have recently explored the effects of varying levels of HOOCCH 2 NH 2 ligand, WO 4 2– , and morpholine borane in an EL CoBW bath, demonstrating the ability to tune the composition of the deposited film as a prerequisite to optimize barrier properties.…”

Section: Elementsmentioning

confidence: 99%

“…EL Co and its alloys are readily deposited using baths containing a variety of reducing agents, including H 2 PO 2 – , ,,− amine boranes, − BH 4 – , , N 2 H 4 , , and carbohydrates that affect mechanical, catalytic, and magnetic properties of the deposit. Like EL Fe, EL Co has been shown useful for the selective plating of TMV and CPMV templates for the fabrication of metal nanostructures ( vide supra , Iron section).…”

Section: Elementsmentioning

confidence: 99%

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Electroless Metallization of the Elements: Survey and Progress

Turró

Dressick

2022

ACS Appl. Electron. Mater.

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The electroless plating of metals and their alloys, oxides, and chalcogenides represents a critically important technology for the automotive, aerospace, machine tools, and, especially, the electronics industries. Since the initial efforts involving the plating of industrially important metals, such as Ni, Co, Cu, Ag, and Au, in the mid-20th century, the process has evolved to encompass a growing number of elements. At the same time, this expansion in the palette of accessible metals has enabled progress in these industries and evoked new nonconventional applications. In this review, we collect and survey available electroless processes in aqueous and organic solvent systems for each element organized according to position in the Periodic Table as a resource for the reader. Examples illustrating progress in the field are presented and are described in sufficient detail to be useful and understandable for both the expert and nonexpert. Given the historical importance of electronics as a driver for development of electroless processes, examples are electronics-related where possible. However, we strive to also include examples of applications in nontraditional fields to provide the reader with a sense of generality available for electroless methods. The review closes with an outlook for the field and a challenge to scientists and engineers to adapt electroless processes for new applications to continue the growth of the field.

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Section: Elementsmentioning

confidence: 99%

Section: Elementsmentioning

confidence: 99%

Section: Elementsmentioning

confidence: 99%

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Electroless Metallization of the Elements: Survey and Progress

Turró

Dressick

2022

ACS Appl. Electron. Mater.

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“…5,6 Self-assembled monolayers (SAMs) with varying functionalities have been demonstrated to direct the assembly of inorganic thin films via ELD. [7][8][9] The reason for this selective deposition is that the functionality of the SAM acts as an accelerator molecule to control crystal heterogeneous nucleation and growth. Amino groups, catechols, and thiols have all been used to seed metallic ELD copper growth on surfaces, [10][11][12] and they can also be used to assist in electrochemical deposition.…”

Section: Introductionmentioning

confidence: 99%

Surface-initiated growth of copper using isonicotinic acid-functionalized aluminum oxide surfaces

et al. 2016

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Isonicotinate self-assembled monolayers (SAM) were prepared on alumina surfaces (A) using isonicotinic acid (iNA). These functionalized layers (iNA-A) were used for the seeded growth of copper films (Cu-iNA-A) by hydrazine hydrate-initiated electroless deposition. The films were characterized by scanning electron microscopy (SEM), electron-dispersive X-ray spectroscopy, atomic force microscopy, Xray photoelectron spectroscopy, X-ray diffraction, and advancing contact angle measurements. The films are Cu 0 but with surface oxidation, and show a faceted morphology, which is more textured (R q = 460 ± 90 nm) compared to the SAM (R q = 2.8 ± 0.5 nm). In contrast, growth of copper films by SnCl 2 /PdCl 2 catalyzed electroless deposition, using formaldehyde (CH 2 O) as the reducing agent, shows a nodular morphology on top of a relatively smooth surface. No copper films are observed in the absence of the isonicotinate SAM. The binding of Cu 2+ to the iNA is proposed to facilitate reduction to Cu 0 and create the seed for subsequent growth. The films show good adhesion to the functionalized surface.

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“…In [8][9][10] methods are used AFM to obtain information about the morphology of the films based on Co-W. In particular, a significant difference was shown in morphology between crystalline and amorphous films on the basis of Co-W was investigated density of nucleation of surface coatings, morphology and electrical properties of films based on Co-W, and has also been investigated relationship between impulse responses and the deposition surface morphology.…”

Section: Introductionmentioning

confidence: 99%

Investigation of the Structure of the Electrodeposited Alloy CoNiW by Methods HAADF STEM and AFM

Kirillov¹,

Modin²,

Пустовалов³

et al. 2015

Materials Science and Energy Engineering (CMSEE 2014)

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In this paper we investigated the structure of amorphous and nanocrystalline alloys of CoNiW obtained by electrolytic deposition. Studies were performed by transmission electron microscopy in HAADF mode and atomic force microscopy. In the course of the work was to obtain new data on the structure of materials. It has been found that tungsten is more homogeneous distributed in the alloy than nickel or cobalt. This is due to higher mobility of the atoms of nickel and cobalt in the electrolyte.

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Thin electroless Co(W,P) film growth on titanium–nitride layer modified by self-assembled monolayer

Cited by 10 publications

References 47 publications

Electroless Metallization of the Elements: Survey and Progress

Electroless Metallization of the Elements: Survey and Progress

Surface-initiated growth of copper using isonicotinic acid-functionalized aluminum oxide surfaces

Investigation of the Structure of the Electrodeposited Alloy CoNiW by Methods HAADF STEM and AFM

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