Thickness Measurement of Aluminum, Titanium, Titanium Silicide, and Tungsten Silicide Films by X‐Ray Fluorescence

Ernst, Stephen; Lee, Chang‐Ou; Lee, Jen‐Jiang

doi:10.1149/1.2096222

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Titanium and Amorphous Silicon Bilayers--in Ic Tech-1

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1989

2022

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Cited by 10 publications

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“…In-line color charts for different thicknesses are of limited value. XRF has already been proposed as a means of measuring the titanium thickness (41). We extend this method to include the measurement of amorphous silicon.…”

Section: Titanium and Amorphous Silicon Bilayers--in Ic Tech-mentioning

confidence: 99%

Analysis of Thin Films in Silicon Integrated Circuit Technology by X‐Ray Fluorescence Spectrometry

Parekh

Nieuwenhuizen

Borstrok

et al. 1991

J. Electrochem. Soc.

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Thin-film analysis in the integrated circuit industry is essential for both process development and production control. In this respect, analysis by x-ray fluorescence spectrometry (XRF) is advantageous due to its precision and speed. XRF has been used to determine the thickness and elemental composition of thin films, including borophosphosilicate glass, titanium and amorphous-silicon multilayers, and aluminum alloys. Furthermore, XRF has been applied to solve contamination and corrosion problems, including the determination of chlorine and fluorine levels in aluminum-based metallizations after plasma etching.

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Section: Titanium and Amorphous Silicon Bilayers--in Ic Tech-mentioning

confidence: 99%