Abstract:The breakdown strength as well as the mechanical strength of ceramic materials decreases with increasing volume. The volume-effect of the mechanical strength can be explained by the Weibull theory. For the breakdown strength the same explanation has been often assumed.In order to validate this assumption breakdown strength and mechanical strength of alumina samples with defined porosities were compared. Differences in the Weibull moduli of breakdown and mechanical strength distributions indicate that the volum… Show more
“…This is already a relative difference of 20.2% related to the large value, and 25.3% related to the small value, respectively. As described in the introduction, dielectric strength is indirectly proportional to the square root of the sample thickness [6,8]. Based on this relationship, a normalized dielectric strength E d,n with respect to a normalized thickness t n can be calculated according to Eq.…”
Section: Discussionmentioning
confidence: 99%
“…A noteworthy characteristic of dielectric strength, especially with respect to test conditions, is its thickness dependence. In contrast to common mechanical strength concepts, dielectric strength shows a 1/ d dependence, where d is the sample thickness [6,8,15]. Neusel and Schneider [15] concluded that the thickness dependence cannot be explained by the Weibull concept.…”
Section: Introductionmentioning
confidence: 96%
“…They concluded that high breakdown strength generally involves weak wear, although their data does not invariably follow this tendency. A proportionality of dielectric strength to the −0.5 power of relative permittivity is shown by different groups of researchers [8,9]. Trapping of charges [10,11] and space charge limited conductivity [12][13][14] are recently discussed to be decisive for breakdown channel formation in ceramics.…”
Dielectric strength testing of ceramics can be performed with various setups and parameters. Comparisons of results from different sources are often not meaningful, because the results are strongly dependent on the actual testing procedure. The aim of this study is to quantify the influence of voltage ramp rate, electrode size, electrode conditioning, and sample thickness on the measured AC dielectric strength of a commercial alumina. Mean values, Weibull moduli, and failure probabilities determined in standardized short time tests are evaluated and related to withstand voltage tests. Dielectric strength values in the range from 21.6 to 33.2 kV•mm -1 were obtained for the same material using different testing procedures. Short time tests resulted in small standard deviations (< 2 kV•mm -1 ) and high Weibull moduli around 30, while withstand tests at voltage levels with low and virtual zero failure probability in short time tests resulted in large scatter of withstand time and Weibull moduli < 1. The strong decrease in Weibull moduli is attributed to progressive damage from partial discharge and depolarization during AC testing. These findings emphasize the necessity of a thorough documentation of testing procedure and highlight the importance of withstand voltage tests for a comprehensive material characterization.
“…This is already a relative difference of 20.2% related to the large value, and 25.3% related to the small value, respectively. As described in the introduction, dielectric strength is indirectly proportional to the square root of the sample thickness [6,8]. Based on this relationship, a normalized dielectric strength E d,n with respect to a normalized thickness t n can be calculated according to Eq.…”
Section: Discussionmentioning
confidence: 99%
“…A noteworthy characteristic of dielectric strength, especially with respect to test conditions, is its thickness dependence. In contrast to common mechanical strength concepts, dielectric strength shows a 1/ d dependence, where d is the sample thickness [6,8,15]. Neusel and Schneider [15] concluded that the thickness dependence cannot be explained by the Weibull concept.…”
Section: Introductionmentioning
confidence: 96%
“…They concluded that high breakdown strength generally involves weak wear, although their data does not invariably follow this tendency. A proportionality of dielectric strength to the −0.5 power of relative permittivity is shown by different groups of researchers [8,9]. Trapping of charges [10,11] and space charge limited conductivity [12][13][14] are recently discussed to be decisive for breakdown channel formation in ceramics.…”
Dielectric strength testing of ceramics can be performed with various setups and parameters. Comparisons of results from different sources are often not meaningful, because the results are strongly dependent on the actual testing procedure. The aim of this study is to quantify the influence of voltage ramp rate, electrode size, electrode conditioning, and sample thickness on the measured AC dielectric strength of a commercial alumina. Mean values, Weibull moduli, and failure probabilities determined in standardized short time tests are evaluated and related to withstand voltage tests. Dielectric strength values in the range from 21.6 to 33.2 kV•mm -1 were obtained for the same material using different testing procedures. Short time tests resulted in small standard deviations (< 2 kV•mm -1 ) and high Weibull moduli around 30, while withstand tests at voltage levels with low and virtual zero failure probability in short time tests resulted in large scatter of withstand time and Weibull moduli < 1. The strong decrease in Weibull moduli is attributed to progressive damage from partial discharge and depolarization during AC testing. These findings emphasize the necessity of a thorough documentation of testing procedure and highlight the importance of withstand voltage tests for a comprehensive material characterization.
“…Non-pottable and/or non-polymeric insulation materials, such as mica, ceramic (e.g., AlN and AlSiC), aramid (e.g., Nomex), polyimide (e.g., Kapton) also feature interesting properties, i.e. high breakdown strength (especially for thin layers), good resistance to partial discharges, and low losses [43], [62]. These materials are typically combined with potted polymeric materials or oils, in order to avoid the presence of air near the electric field hot spots, which can lead to partial discharges [56].…”
“…33 For thin films, the breakdown process can be described by an intrinsic, electric breakdown model originally proposed by von Hippel. [34][35][36] Bulk samples show a dependence of the breakdown strength on the sample thickness, 33,[37][38][39] which cannot be explained by the intrinsic, electric breakdown model. Different breakdown mechanisms of bulk samples and thin films might also be associated with different conduction mechanisms.…”
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