Thick-Film SOI Wafers

Mäkinen, Jari

doi:10.1016/b978-0-8155-1594-4.00007-3

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Delamination Of Thermo-compression Bonded Soi Wafers1

Introduction1

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2019

2023

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Cited by 2 publications

(2 citation statements)

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“…Wafer 2's BOX layer is removed following DRIE (Fig. 5b), creating a force imbalance in its DL due to strain from the oxide mask [14]. This causes the membrane structure to deflect.…”

Section: Delamination Of Thermo-compression Bonded Soi Wafersmentioning

confidence: 99%

See 1 more Smart Citation

Toward Industrial Exploitation of THz Frequencies: Integration of SiGe MMICs in Silicon-Micromachined Waveguide Systems

Campion

Zirath

et al. 2019

IEEE Trans. THz Sci. Technol.

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“…Wafer 2's BOX layer is removed following DRIE (Fig. 5b), creating a force imbalance in its DL due to strain from the oxide mask [14]. This causes the membrane structure to deflect.…”

Section: Delamination Of Thermo-compression Bonded Soi Wafersmentioning

confidence: 99%

“…Hetero. 0.014 -0.018 [12] Silicon-micromachining This Work Low 11 <1 µm <1 µm High 149 [14] Homo. [15] Homo.…”

Section: Introductionmentioning

confidence: 99%

Toward Industrial Exploitation of THz Frequencies: Integration of SiGe MMICs in Silicon-Micromachined Waveguide Systems

Campion

Zirath

et al. 2019

IEEE Trans. THz Sci. Technol.

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show abstract

Fabrication and characterization of silicon-on-insulator wafers

Kim,

Lee

2023

Micro and Nano Syst Lett

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Silicon-on-insulator (SOI) wafers offer significant advantages for both Integrated circuits (ICs) and microelectromechanical systems (MEMS) devices with their buried oxide layer improving electrical isolation and etch stop function. For past a few decades, various approaches have been investigated to make SOI wafers and they tend to exhibit strength and weakness. In this review, we aim to overview different manufacturing routes for SOI wafers with specific focus on advantages and inherent challenges. Then, we look into how SOI wafers are characterized for quality assessment and control. We also provide insights towards potential future directions of SOI technology to further accelerate ever-growing IC and MEMS industries.

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Thick-Film SOI Wafers

Cited by 2 publications

References 39 publications

Toward Industrial Exploitation of THz Frequencies: Integration of SiGe MMICs in Silicon-Micromachined Waveguide Systems

Toward Industrial Exploitation of THz Frequencies: Integration of SiGe MMICs in Silicon-Micromachined Waveguide Systems

Fabrication and characterization of silicon-on-insulator wafers

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