Thermophysical Properties of Sn–Ag–Cu Based Pb-Free Solders

Kim, Sok Won; Lee, Jaeran; Jeon, Bo-Min; Jung, Eun Hee; Lee, Sang Hyun; Kang, Kweon Ho; Lim, Kwon Taek

doi:10.1007/s10765-009-0603-5

Cited by 7 publications

(3 citation statements)

References 9 publications

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“…Different thermal conductivity of the components (PCBs, Cu lead or electrical parts) composes different temperature gradients in the solder joint during solidification. Thermal conductivities of Sn-Ag-Cu alloys between 210 and 220 W m −1 K −1 were found by Kim et al [5] at room temperature. The highest thermal conductivity in this multi-component joint has Cu (386 W m −1 K −1 ), while the lowest thermal conductivity has one of the most commonly used PCB materials FR4 (0.2 W m −1 K −1 ).…”

Section: Introductionmentioning

confidence: 74%

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Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders

Rudajevová¹,

Dusek²

2013

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Presented work shows the results of DSC measurement for six Sn based solders. The alloys Sn96Ag4, Sn99Cu1, Sn97Cu3, Sn96.5Ag3Cu0.5, Sn95.5Ag3.8Cu0.7 and Sn63Pb37 were studied in the temperature range from room temperature up to 400 • C. The transformation temperatures for melting as well as for solidification were influenced by the composition and thermal history of the alloys. The thermal history was altered by changing the maximum thermal cycle temperature and the heating/cooling rate. It is shown that the rate of solidification is far larger than that of the melting. The solidification rate is not influenced by neither the composition nor the thermal history of the material. Analysis of these results is presented.

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Section: Introductionmentioning

confidence: 74%

“…1) for our Sn-Ag-Cu based alloys. In Kim et al, the work of [5], it was found that the thermal diffusivity of various Sn-Ag-Cu based alloys differs only marginally. It may be assumed that similar differences in the thermal diffusivity exist even for the liquid phases.…”

Section: Resultsmentioning

confidence: 99%

Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders

Rudajevová¹,

Dusek²

2013

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“…Based on the analysis of several multi-component systems, two sets of alloys are potential substitutes for lead soldering. The first groups are the Sn-Ag-Cu (SAC) alloys with the addition of different metals (Bi, Zn, In and Sb) 1–6 . Previous studies have recommended the Sn-Ag-Cu-Bi quaternary system as a promising candidate for lead-free solders, as the biggest advantage of SnAgCuBi over welds SnAgCu is the lower melting temperature.…”

Section: Introductionmentioning

confidence: 99%

Temperature dependences of surface tension, density and viscosity study of Sn-Ag-Cu with Bi additions using theoretical models

M’chaar

Sabbar

Moudane

2019

Sci Rep

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In this work, the kohler, Muggianu,Toop and Hillert geometric models were used to calculate the surface tension, molar volume and density of the liquid Sn-Ag-Cu-Bi quaternary alloys along three selected sections xSn:xAg:xCu = 1:1:1, 1:1:2 and 1:2:1 in the temperature range of 923 K–1423 K. The choice of this temperature range was made on the basis of the calculation results of the liquidus line of the alloys belonging to the three sections. The same properties have been estimated for five selected Sn2.7Ag0.86Cu3.86Bi, Sn3.13Ag0.48Cu4.02Bi, Sn2.95Ag0.53Cu6.81Bi, Sn2.68Ag1.01Cu6.62Bi and Sn3.24Ag0.75Cu1.76Bi quaternary alloys between 623 K and 1123 K for comparison with the available experimental data. Moreover, the surface tension and density of these five alloys have also been calculated on the basis of Guggenheim and theoretical equation, respectively. In addition, the Seetharaman-sichen and Kaptay equations were extended to estimate the viscosity of SAC + Bi alloys. We also discussed the influence of Bismuth addition in liquid Sn-Ag-Cu-Bi. Estimated values show that Bi increases molar volume and density but decreases the surface tension and viscosity. On the other hand, the surface tensions diminish with the temperature for the all studied models, with the exception of some concentration of Bismuth; an inverse tendency is observed (dσ/dT) > 0. While, the density diminishes with increasing temperature for all alloys (dσ/dT) < 0. These models have been shown to be a great alternative for calculating the thermo-physical properties of quaternary systems.

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Surface Tension, Density, and Thermal Expansion of (Bi-Ag)eut-Zn Alloys

Pstruś

Fima

Gąsior

2011

Journal of Elec Materi

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The thermophysical properties of Bi-Ag eutectic-based alloys with additions of 3 at.%, 6 at.%, and 9 at.% Zn are presented. The density of liquid alloys was determined using the dilatometric method, while the surface tension was measured using the maximum bubble pressure method. Thermal expansion of solid alloys was measured with an optical dilatometric technique. It was found that addition of zinc to the Bi-Ag eutectic slightly decreases density, while an increase of the surface tension and thermal expansion coefficient is observed. Relatively good agreement is observed between surface tension calculated from the thermodynamic model and the experimental data.

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Thermophysical Properties of Sn–Ag–Cu Based Pb-Free Solders

Cited by 7 publications

References 9 publications

Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders

Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders

Temperature dependences of surface tension, density and viscosity study of Sn-Ag-Cu with Bi additions using theoretical models

Surface Tension, Density, and Thermal Expansion of (Bi-Ag)eut-Zn Alloys

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