Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders

Rudajevová, A.; Dusek, Karel

doi:10.4149/km_2012_5_295

Cited by 2 publications

(2 citation statements)

References 11 publications

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“…Important parameters which should be respected in the soldering process are total time soldering, preheating, time above liquid and next process times, wettability, compatibility with carrier substrate and surface finish [5] and thermal history of the alloys [6].…”

Section: Introductionmentioning

confidence: 99%

Investigation of the Mechanical Properties of Lead-Free Solder Materials

Otahal¹,

Adámek²,

Jansa³

et al. 2013

KEM

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Reliability and life-time of electric/electronic products is still a highly actual and discussed topic. Every electric/electronic product is heterogeneous system which consists not only from components and constructional parts, but also from many interconnections. Basic segments of interconnection are solder joints, recently created by lead-free materials. The passing from well-proven lead solders to lead free compositions brought many new aspects in reliability and life-time of electronic systems. Some of the negative factors are their poor electro-mechanical properties, which are based on complicated microstructure of interlayer interface. This fact causes defects in solder joints and consequential failure of the function. This article is focused on an investigation of mechanical properties of lead-free solder joints. There are investigated various properties of common lead-free solder paste depending on various concentrations of O2 by reflow process and on various components size. Next, there are shown microstructures by micro sections for various concentrations of O2. Mechanical properties (mechanical strength) are tested by shear test equipment DAGE 2400.

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Section: Introductionmentioning

confidence: 99%

Investigation of the Mechanical Properties of Lead-Free Solder Materials

Otahal¹,

Adámek²,

Jansa³

et al. 2013

KEM

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“…It is therefore evident that electronic joints where intermetallic compounds exist in the interface between the electronic parts and solder have very different nucleation centers compared with the pure alloy when studied alone. In our previous study, 3 63 Pb 37 (28°C). This significant difference is evidently a consequence of the fact that, in the Sn-Pb system, intermetallic compounds do not create nucleation centers for solidification.…”

Section: Introductionmentioning

confidence: 99%

Study of Undercooling and Recalescence During Solidification of Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5 Solders in Real Electronic Joints

Rudajevová

Dusek

2014

Journal of Elec Materi

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Undercooling and recalescence were studied using the differential scanning calorimetry (DSC) method on real electronic systems. Two solder pastes, Sn 62.5 Pb 36.5 Ag 1 and Sn 96.5 Ag 3 Cu 0.5 , were used for preparation of electronic joints. Various combinations of these solders and soldering pads with different surface finishes such as Cu, Cu-Ni-Au, Cu-Sn, and Cu-Sn 99 Cu 1 were used. During melting of both pastes, the Sn and Sn 99 Cu 1 surface finishes immediately dissolved in the solder and the Cu surface coating was exposed to the melt. Therefore, practically the same undercooling was found for the Cu, Cu-Sn, and Cu-Sn 99 Cu 1 coatings. The lowest undercooling was found for the Cu-Ni-Au surface finish for both solder pastes. If two separated electronic joints were made on the sample, two separate peaks were found in the DSC signal during solidification. In the sample with only one joint, only one exothermic peak was found. These findings were observed for all paste/surface finish combinations. These data were analyzed, showing that this effect is a consequence of undercooling and recalescence: Latent heat released during solidification of the joint increases the surrounding temperature and influences all the processes taking place.

show abstract

Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders

Cited by 2 publications

References 11 publications

Investigation of the Mechanical Properties of Lead-Free Solder Materials

Investigation of the Mechanical Properties of Lead-Free Solder Materials

Study of Undercooling and Recalescence During Solidification of Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5 Solders in Real Electronic Joints

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