2010
DOI: 10.3139/146.110357
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Thermophysical properties of liquid tin–bismuth alloys

Abstract: Thermophysical properties of liquid tin-bismuth alloysTin-bismuth alloys are under intense consideration as favourable lead-free solders for consumer electronics and telecommunications. The electrical and thermal conductivity, viscosity, surface tension and density were studied in a wide temperature range above the liquidus. The scaling relations have been proposed. A comparison with data available in literature is given.

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Cited by 28 publications
(2 citation statements)
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“…The low melting point alloy Sn 60 Bi 40 serves as model liquid, which has a liquidus temperature of 170°C. The temperature‐dependant material data of that alloy are reported by Plevachuk . The facility operates in the temperature range between 200 and 400°C.…”
Section: Methodsmentioning
confidence: 99%
“…The low melting point alloy Sn 60 Bi 40 serves as model liquid, which has a liquidus temperature of 170°C. The temperature‐dependant material data of that alloy are reported by Plevachuk . The facility operates in the temperature range between 200 and 400°C.…”
Section: Methodsmentioning
confidence: 99%
“…All components are made from stainless steel. The low melting point alloy Sn60Bi40 is used as model liquid, whose temperaturedependent material data are reported in [9]. The liquidus temperature of 170°C allows for an operation of the facility in a temperature range between 200°C and 400°C.…”
Section: The Limmcast Facilitymentioning
confidence: 99%