Thermomigration induced degradation in solder alloys

Basaran, Cemal; Li, Shidong; Abdulhamid, Mohd F.

doi:10.1063/1.2943261

Cited by 40 publications

(14 citation statements)

References 33 publications

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“…As a potential reliability issue of solder, TM in Pb-free solders has been reported in a few cases. [6][7][8] Recently, Sn58Bi solder has been used commercially to replace SnPb solder for low-temperature applications. 9 The EM behavior of Sn58Bi solder joints has been studied.…”

Section: Introductionmentioning

confidence: 99%

Thermomigration and electromigration in Sn58Bi solder joints

Chan

2009

Journal of Applied Physics

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Thermomigration ͑TM͒ in Sn58Bi solder was detected in Cu/Sn58Bi/Ni solder joints supplied with direct current. Thermal electric finite-element simulation showed that a thermal gradient of 527°C / cm existed in a solder joint when a current density of 5 ϫ 10 3 A / cm 2 was applied to the structure at 50°C. Depending on the direction of the current, TM was found to assist or counteract electromigration ͑EM͒ on the diffusion of Bi atoms. The atomic fluxes of Bi induced by EM and TM were estimated separately. EM-enhanced cross interaction between Cu and Ni across the solder joint was also detected, which led to the intermetallic compound ͑IMC͒ at Ni side or the Cu side of the joint that electron flow was from the Cu side to the Ni side is thinner than that of corresponding IMC in the joint stressed with current in opposite direction. For the joint as reflowed, the IMC at the Ni side was ͑Cu, Ni͒ 6 Sn 5 instead of Ni 3 Sn 4 and the IMC at the Cu side was Cu 6 Sn 5 without Ni atoms contained. When Ni wire set as anode, the IMC at the Ni side was still ͑Cu, Ni͒ 6 Sn 5 even after the joint was stressed for 384 h. However, it turned into ͑Ni, Cu͒ 3 Sn 4 if Ni wire set as cathode. Regardless of the directions of the electric current, the IMC at the Cu side was Cu 6 Sn 5 at all time. For the joint that Cu wire set as anode, the growth of Ni 3 Sn 4 at the cathode side was enhanced by EM and TM, while the growth of Cu 6 Sn 5 at the anode side was retarded.

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Section: Introductionmentioning

confidence: 99%

Thermomigration and electromigration in Sn58Bi solder joints

Chan

2009

Journal of Applied Physics

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“…It is a mechanothermodynamical (MTD) system uniting the laws of Newtonian mechanics and thermodynamics. The union of Newtonian mechanics and thermodynamics was formulated and experimentally proved for metals, alloys, and composites [ 5 , 6 , 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 ].…”

Section: Introductionmentioning

confidence: 99%

On the Development of Mechanothermodynamics as a New Branch of Physics

Sosnovskiy¹,

Sherbakov

2019

Entropy

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This paper aims to substantiate and formulate the main principles of the physical discipline-mechanothermodynamics that unites Newtonian mechanics and thermodynamics. Its principles are based on using entropy as a bridge between mechanics and thermodynamics. Mechanothermodynamics combines two branches of physics, mechanics and thermodynamics, to take a fresh look at the evolution of complex systems. The analysis of more than 600 experimental results allowed for determining a unified mechanothermodynamical function of limiting states (critical according to damageability) of polymers and metals. They are also known as fatigue fracture entropy states.

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“…Expecially under high current density, the indium solder is sensitive to electromigration, and the reliability of indium solder die bonding of high power semiconductor lasers will be significiantly impacted by electromigration. [2][3][4][5] The objective of this paper is to evaluate and study the reliability of indium solder die bonding for high power laser diode arrays.…”

Section: Introductionmentioning

confidence: 99%

Reliability of indium solder die bonding of high power cm-bars

Guoguang¹,

Huang²,

Yunfei³

2010

2010 11th International Conference on Electronic Packaging Technology &Amp; High Density Packaging

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High power semiconductor lasers have found increased applications. Indium solder is one of the most widely used solders in high power laser die bonding, its' reliability is rated as the key parameter deciding about the more or less extensive use of indiun solder die bonding of high power diode arrays. In this paper, 20 samples were tested under two conditions, three degradation modes were observed during the lifetime test, the failure analysis results showed that the stress and defects induced during the indium solder bonding process play a key role in the degradation behavior of the bars.

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Thermomigration induced degradation in solder alloys

Cited by 40 publications

References 33 publications

Thermomigration and electromigration in Sn58Bi solder joints

Thermomigration and electromigration in Sn58Bi solder joints

On the Development of Mechanothermodynamics as a New Branch of Physics

Reliability of indium solder die bonding of high power cm-bars

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