AIP Conference Proceedings
 2010
DOI: 10.1063/1.3527126
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Thermomechanical Reliability Challenges For 3D Interconnects With Through-Silicon Vias

Suk Kyu Ryu
1
,
Kaijun Lu
2
,
Xuefeng Zhang
3
et al.
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Cited by 11 publications
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References 20 publications
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TSV electrical and mechanical modeling for thermo-mechanical delamination

Kannan
1
,
Kannan
2
,
Kim
3
et al. 2013
2013 IEEE 63rd Electronic Components and Technology Conference
10
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4
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TSV electrical and mechanical modeling for thermo-mechanical delamination

Kannan
1
,
Kannan
2
,
Kim
3
et al. 2013
2013 IEEE 63rd Electronic Components and Technology Conference
10
0
4
0
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SIMEIT-project: High precision inertial sensor integration on a modular 3D-Interposer platform

Steller
1
,
Meinecke
2
,
Gottfried
3
et al. 2014
2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
8
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1
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Characterization of in-plane stress in TSV array — A unit model approach

Chen
1
2014
2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
4
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4
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