SIMEIT-project: High precision inertial sensor integration on a modular 3D-Interposer platform

Steller, Wolfram; Meinecke, Christoph; Gottfried, Knut; Woldt, Gregor; Günther, Wolfgang; Wolf, Marcus; Lang, K.-D.

doi:10.1109/ectc.2014.6897446

Cited by 8 publications

(1 citation statement)

References 7 publications

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“…Based on our system description, different 2.5/3D integration schemes can be modelled (SiP, 3D IC, ...). As an example used throughout this paper, Figure 2 shows the integration of a processor and memory using the Fraunhofer interposertechnology [8].…”

Section: Unified Data Handlingmentioning

confidence: 99%

Design rule check and layout versus schematic for 3D integration and advanced packaging

Fischbach

Heinig

Schneider

2014

2014 International 3D Systems Integration Conference (3DIC)

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In this paper we will present a solution for automatic design rule checking (DRC) and layout versus schematic comparison (LVS) of 2.5D/3D systems, which enables an early check of subcomponents as well as whole system checks. The advantage of our approach is the unique data handling for different DRC and LVS runs, which allows the automatic derivation of partial design data from one single data base. Such an approach is essential for industrial driven designs of 2.5/3D systems. Otherwise, there is a high risk of mistakes related to data conversion and versioning problems. Such data handling issues can result in erroneous designs and cost extensive redesigns

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Section: Unified Data Handlingmentioning

confidence: 99%