Thermomechanical Deformations of Power Modules with Sintered Metal Buffer Layers under Consideration of the Operating Time and Conditions

Schiffmacher, Alexander; Wilde, Juergen; Kempiak, Carsten; Lindemann, Andreas; Rudzki, Jacek; Osterwald, Frank

doi:10.1109/ectc32862.2020.00094

Cited by 7 publications

(3 citation statements)

References 7 publications

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“…Capabilities of the sensor at higher measurement rates were tested by measuring IGBT-chips switched via active power cycling [1,20]. For these measurements, the substrates were replaced with Al 2 O 3 and the chips were additionally bonded with a copper bond buffer and heavy copper bonding wires.…”

Section: Measurementsmentioning

confidence: 99%

“…Often such electronics are operating under a periodic load, which can reach millions of cycles during the lifetime of a device and can lead to a failure. Typical failures are for example delamination of components from their substrates, or breaking of bonding wires [1]. To increase the fault tolerance and provide opportunities for improvement of the devices, it is essential to understand the physical mechanisms underlying the failures.…”

Section: Introductionmentioning

confidence: 99%

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High-speed electronic speckle pattern interferometry for analysis of thermo-mechanical behavior of electronic components

Laskin

Huai²,

Fratz

et al. 2021

Optical Measurement Systems for Industrial Inspection XII

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The electronics industry is creating complex miniaturized devices with steadily higher power density. The increase of maximum operating temperatures affects the thermo-mechanical load and imposes greater requirements on the quality of electronic packages. Fast and reliable methods for inspecting the quality of electronic components can help to improve production quality and to reduce waste and environmental burden. We present a compact optical sensor based on Electronic Speckle Pattern Interferometry (ESPI) that provides a possibility to carry out such control in a fast, precise and non-contact manner and can be integrated directly in a production line. Analysing thermo-mechanical deformations of objects under study, the system is capable of identifying common defects in electronic modules, such as die attachment delamination.

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Section: Measurementsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

High-speed electronic speckle pattern interferometry for analysis of thermo-mechanical behavior of electronic components

Laskin

Huai²,

Fratz

et al. 2021

Optical Measurement Systems for Industrial Inspection XII

Self Cite

View full text Add to dashboard Cite

show abstract

“…Such mismatch results in high localization of shear stresses in the die attachment, leading to crack initiation as well as propagation triggering electrical discontinuities (Wang et al , 2023; Li et al , 2022). For this reason, several metallic and nonmetallic die bonds have been developed to ensure high reliability and improved thermal fatigue performance of power electronics (Grieger et al , 2016; Schiffmacher et al , 2020; Kohler and Wilde, 2020). Therefore, the accurate evaluations of the electrical, thermal and mechanical properties of such die attachments are very essential for producing high-quality electronic device designs (Rheingans et al , 2022).…”

Section: Introductionmentioning

confidence: 99%

A study on the thermomechanical response of various die attach metallic materials of power electronics

Gharaibeh,

Wilde

2024

SSMT

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Purpose In power electronics, there are various metallic material systems used as die attachments. The complete understanding of the thermomechanical behavior of such interconnections is very important. Therefore, this paper aims to examine the thermomechanical response of four famous die attach materials, including sintered silver, sintered nano-copper particles, gold-tin solders and silver-tin transient liquid phase (TLP) bonds, using nonlinear finite element analysis. Design/methodology/approach During the study, the mechanical properties of all die attach systems, including elastic and viscoplasticity parameters, are obtained from literature studies and hence incorporated into the numerical analysis. Subsequently, the bond stress–strain relationships, stored inelastic strain energies and equivalent plastic strains are thoroughly examined. Findings The results showed that the silver-tin TLP bonds are more likely to develop higher inelastic strain energy densities, while the sintered silver and copper interconnects would possess higher plastic strains and deformations. Suggesting higher damage to such metallic die attachments. The expensive gold-based solders have developed least inelastic strain energy densities and least plastic strains as well. Thus, they are expected to have improved fatigue performance compared to other bonding configurations. Originality/value This paper extensively investigates and compares the mechanical and thermal response of various metallic die attachments. In fact, there are no available research studies that discuss the behavior of such important die attachments of power electronics when exposed to mechanical and thermomechanical loads.

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In Situ Degradation Monitoring Methods during Lifetime Testing of Power Electronic Modules

Schiffmacher

Strahringer

Malasani

et al. 2021

2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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Thermomechanical Deformations of Power Modules with Sintered Metal Buffer Layers under Consideration of the Operating Time and Conditions

Cited by 7 publications

References 7 publications

High-speed electronic speckle pattern interferometry for analysis of thermo-mechanical behavior of electronic components

High-speed electronic speckle pattern interferometry for analysis of thermo-mechanical behavior of electronic components

A study on the thermomechanical response of various die attach metallic materials of power electronics

In Situ Degradation Monitoring Methods during Lifetime Testing of Power Electronic Modules

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