High-speed electronic speckle pattern interferometry for analysis of thermo-mechanical behavior of electronic components

Abstract

The electronics industry is creating complex miniaturized devices with steadily higher power density. The increase of maximum operating temperatures affects the thermo-mechanical load and imposes greater requirements on the quality of electronic packages. Fast and reliable methods for inspecting the quality of electronic components can help to improve production quality and to reduce waste and environmental burden. We present a compact optical sensor based on Electronic Speckle Pattern Interferometry (ESPI) that provides a possibility to carry out such control in a fast, precise and non-contact manner and can be integrated directly in a production line. Analysing thermo-mechanical deformations of objects under study, the system is capable of identifying common defects in electronic modules, such as die attachment delamination.