Thermography techniques for integrated circuits and semiconductor devices

Abstract

PurposeThe goal of this review paper is to provide information on several commonly used thermography techniques in semiconductor and micro‐device industry and research today.Design/methodology/approachThe temperature imaging or mapping techniques include thin coating methods such as liquid crystal thermography and fluorescence microthermography, contact mechanical methods such as scanning thermal microscopy, and optical techniques such as infrared microscopy and thermoreflectance. Their principles, characteristics and applications are discussed.FindingsThermal issues play an important part in optimizing the performance and reliability of high‐frequency and high‐packing density electronic circuits. To improve the performance and reliability of microelectronic devices and also to validate thermal models, accurate knowledge of local temperatures and thermal properties is required.Originality/valueThe paper provides readers, especially technical engineers in industry, a general knowledge of several commonly used thermography techniques in the semiconductor and micro‐device industries.

Simultaneous imaging of magnetic field and temperature distributions by magneto optical indicator microscopy

“…For 1000-averaged averaged images, the calculated NETD of the gold thin film and MOIs were: 1.12 K for gold thin film at λ  = 530 nm; 0.18 K•μm and 0.27 K•μm for x = 1 and x = 2 MOIs at λ  = 530 nm; 1.06 K•μm for x = 2 MOI at λ  = 625 nm. Therefore, we can conclude that the temperature sensitivity of the MOI with x = 1 at λ  = 530 nm is around 0.2 K•μm, and this value is comparable to that of modern thermal imagers (35–200 mK)7824252627.…”

“…However, the real operation condition of an electronic device always involves a change of temperature induced by electrical energy dissipation. In particular, characterization of a thermal property for a micro-scaled device is critical for evaluating the device performance, reliability, and durability78. Therefore, if the MOIM can visualize the temperature simultaneously with the magnetic field distribution, it could be an excellent measurement platform that provides rich information to test and evaluate a miniaturized modern electronic device.…”

A Review of Raman Thermography for Electronic and Opto-Electronic Device Measurement With Submicron Spatial and Nanosecond Temporal Resolution

“…Calibration of the thermoreflectance coefficient can be challenging as the change in reflectivity with temperature is often small, however it is possible by performing careful measurements of specially prepared samples [27]. Liquid crystal thermography is another optical technique and relies on the known phase transition temperatures of liquid crystals [28]. However, it is less convenient and no longer commonly used; multiple depositions of liquid crystals with different phase transition temperatures are needed to map each temperature contour.…”

Survey of thermography in electronics inspection

“…The diagram shows a sharp temperature sensing thermocouple tip mounted on a cantilever probe, The sample is scanned laterally while cantilever defections are monitored using a laser beam deflection technique. Topographical and thermal images can be thermally obtained [39]. …”