Thermoelectric Mixed Thick-/Thin Film Microgenerators Based on Constantan/Silver

Gierczak, Mirosław; Prażmowska–Czajka, Joanna; Dziedzic, Andrzej

doi:10.3390/ma11010115

Cited by 24 publications

(8 citation statements)

References 34 publications

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“…The experiments showed that for a fixed P × d-value, there is an increasing deviation |∆S| from the bulk value as the film grows thinner. A similar observation was done by Gierczak et al [27]. This is a classic observation of the size-effect.…”

Section: Discussionsupporting

confidence: 82%

The Seebeck Coefficient of Sputter Deposited Metallic Thin Films: The Role of Process Conditions

Cougnon

Depla

2019

Coatings

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Because of their reduced dimensions and mass, thin film thermocouples are a promising candidate for embedded sensors in composite materials, especially for application in lightweight and smart structures. The sensitivity of the thin film thermocouple depends however on the process conditions during deposition. In this work, the influence of the discharge current and residual gas impurities on the Seebeck coefficient is experimentally investigated for sputter deposited copper and constantan thin films. The influence of the layer thickness on the film Seebeck coefficient is also discussed. Our observations indicate that both a decreasing discharge current or an increasing background pressure results in a growing deviation of the film Seebeck coefficient compared to its bulk value. Variations in discharge current or background pressure are linked as they both induce a variation in the ratio between the impurity flux to metal flux towards the growing film. This latter parameter is considered a quantitative measure for the background residual gas incorporation in the film and is known to act as a grain refiner. The observed results emphasize the importance of the domain size on the Seebeck coefficient of metallic thin films.

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Section: Discussionsupporting

confidence: 82%

The Seebeck Coefficient of Sputter Deposited Metallic Thin Films: The Role of Process Conditions

Cougnon

Depla

2019

Coatings

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“…For calculations related to forced convection, the values for the assumed cooling air temperature of the system was used ( T air = 20 °C). For free convection, temperature T AV was used, where:TAV=TCPU+Tair2=70+202=45 onormalC.This is the arithmetic mean of the maximum surface temperature of the heat sink ( T CPU ) and the cooling air ( T air ) [26].…”

Section: Table A1mentioning

confidence: 99%

“…This is the arithmetic mean of the maximum surface temperature of the heat sink ( T CPU ) and the cooling air ( T air ) [26].…”

Section: Table A1mentioning

confidence: 99%

Modelling of the Temperature Difference Sensors to Control the Temperature Distribution in Processor Heat Sink

Markowski¹,

Gierczak²,

Dziedzic³

2019

Micromachines

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This paper has three main purposes. The first is to investigate whether it is appropriate to use a planar thick-film thermoelectric sensor to monitor the temperature difference in a processor heat sink. The second is to compare the efficiency of two heat sink models. The third is to compare two kinds of sensors, differing in length. The model of the CPU heat sink sensor system was designed for numerical simulations. The relations between the CPU, heat sink, and the thermoelectric sensor were modelled because they are important for increasing the efficiency of fast processors without interfering with their internal structure. The heat sink was mounted on the top of the thermal model of a CPU (9.6 W). The plate fin and pin fin heat sinks were investigated. Two planar thermoelectric sensors were mounted parallel to the heat sink fins. These sensors monitored changes in the temperature difference between the CPU and the upper surface of the heat sink. The system was equipped with a cooling fan. Switching on the fan changed the thermal conditions (free or forced convection). The simulation results showed the temperature gradient appearing along the sensor for different heat sinks and under different thermal conditions. Comparison of the results obtained in the simulations of the CPU heat sink sensor systems proves that changes in the cooling conditions can cause a strong, step change in the response of the thermoelectric sensor. The results suggest that usage of the pin fin heat sink model is a better solution for free convection conditions. In the case of strong forced convection the heat sink type ceases to be significant.

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“…The Zn-Sb binary material is made of ZnSb and β-Zn 4 Sb 3 which are promising P -type thermoelectric materials for low-cost energy production, intended to use at intermediate range of temperatures (between room temperature and 350 °C) [8]. Thin film technique can be an appropriate method for upgrading the properties of thermoelectric materials due to low dimensional quantum confinement [9,10,11,12,13]. The properties improvement of thin film TE materials has introduced a great potential in different applications such as miniaturized sensors, micro power sources, and other low power applications.…”

Section: Introductionmentioning

confidence: 99%

Energy Harvesting from a Thermoelectric Zinc Antimonide Thin Film under Steady and Unsteady Operating Conditions

et al. 2018

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In practice, there are some considerations to study stability, reliability, and output power optimization of a thermoelectric thin film operating dynamically. In this study stability and performance of a zinc antimonide thin film thermoelectric (TE) specimen is evaluated under transient with thermal and electrical load conditions. Thermoelectric behavior of the specimen and captured energy in each part of a thermal cycle are investigated. Glass is used as the substrate of the thin film, where the heat flow is parallel to the length of the thermoelectric element. In this work, the thermoelectric specimen is fixed between a heat sink exposed to the ambient temperature and a heater block. The specimen is tested under various electrical load cycles during a wide range of thermal cycles. The thermal cycles are provided for five different aimed temperatures at the hot junction, from 160 to 350 °C. The results show that the specimen generates approximately 30% of its total electrical energy during the cooling stage and 70% during the heating stage. The thin film generates maximum power of 8.78, 15.73, 27.81, 42.13, and 60.74 kW per unit volume of the thermoelectric material (kW/m3), excluding the substrate, corresponding to hot side temperature of 160, 200, 250, 300, and 350 °C, respectively. Furthermore, the results indicate that the thin film has high reliability after about one thousand thermal and electrical cycles, whereas there is no performance degradation.

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Thermoelectric Mixed Thick-/Thin Film Microgenerators Based on Constantan/Silver

Cited by 24 publications

References 34 publications

The Seebeck Coefficient of Sputter Deposited Metallic Thin Films: The Role of Process Conditions

The Seebeck Coefficient of Sputter Deposited Metallic Thin Films: The Role of Process Conditions

Modelling of the Temperature Difference Sensors to Control the Temperature Distribution in Processor Heat Sink

Energy Harvesting from a Thermoelectric Zinc Antimonide Thin Film under Steady and Unsteady Operating Conditions

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