2015
DOI: 10.1016/j.ijmecsci.2015.10.013
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Thermoelastic response of thin plate with variable material properties under transient thermal shock

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Cited by 38 publications
(3 citation statements)
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“…The thermoelastic coupling term in the heat conduction equation is so small and usually neglected in practice 44 . It is important in many applications, such as thermal shocks 45 , 46 , ultrafast laser heating in the thermal processing of materials 47 , 48 , modeling of the vibration of resonant microelectromechanical systems (MEMS) 49 52 , and dynamic crack propagation 53 . Therefore, the thermoelastic effect should be taken into account in the mentioned application.…”
Section: Governing Equationsmentioning
confidence: 99%
“…The thermoelastic coupling term in the heat conduction equation is so small and usually neglected in practice 44 . It is important in many applications, such as thermal shocks 45 , 46 , ultrafast laser heating in the thermal processing of materials 47 , 48 , modeling of the vibration of resonant microelectromechanical systems (MEMS) 49 52 , and dynamic crack propagation 53 . Therefore, the thermoelastic effect should be taken into account in the mentioned application.…”
Section: Governing Equationsmentioning
confidence: 99%
“…The thermoelastic coupling term in the heat conduction equation is so small and usually neglected in practice [37]. It has been found to be important in many applications, such as thermal shocks [38][39], ultrafast laser heating in the thermal processing of materials [40][41], modeling of the vibration of resonant microelectromechanical systems (MEMS) [42][43], and dynamic crack propagation [44]. Therefore, the thermoelastic effect should be taken into account in the mentioned application.…”
Section: Two-dimensional Hyperbolic Heat Transfer Equationmentioning
confidence: 99%
“…The thermoelastic coupling terms occurring in the heat conduction equation are usually small and neglected in practice [1][2][3]. Taking them into account, however, has been found important in many applications, such as the modeling of the vibration of resonant microelectromechanical systems (MEMS) [4][5][6], dynamic crack propagation [7][8][9], thermal shocks [10][11][12][13][14], ultrafast laser heating in thermal processing of materials [15][16][17][18], and wave propagation [19][20][21][22]. In some of these applications, using the Cattaneo-Vernotte conduction model instead of Fourier's law and/or accounting for the temperature dependence of the material moduli have resulted in better predictions [14,23,24].…”
Section: Introductionmentioning
confidence: 99%