Thermodynamic Properties of Liquid Al-Sn-Zn Alloys: A Possible New Lead-Free Solder Material

Knott, Sabine; Mikula, Adolf

doi:10.2320/matertrans.43.1868

Cited by 31 publications

(42 citation statements)

References 36 publications

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“…18) Earlier, a thermodynamic assessment of the ternary system was reported by Fries et al 19) However, in view of recent experimental thermodynamic data of the liquid phase 20) 21) and also previous CALPHAD calculation. 19) However, these results offers no significant advantage over binary Sn-Zn eutectic.…”

Section: Al-sn-zn Systemmentioning

confidence: 99%

Some Fundamental Issues in the Use of Zn-Containing Lead-Free Solders for Electronic Packaging

2004

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A synergistic approach is applied to address the major concerns about the use of Zn-containing lead-free solders for electronic packaging. Using computational thermodynamics as a predictive tool, the phase stability of the Ag-Al-Cu-In-Sn-Zn system is examined to design a Zncontaining lead-free solder with melting characteristics similar to near-eutectic Pb-Sn solder. Theoretically, it is found that a Sn-0.3 mass%Al-4.2 mass%In-7.8 mass%Zn solder has a melting point (liquidus temperature) of 185 C and a solidification range of 10 C. It is demonstrated that environmentally benign fluxes containing tin-organometallics significantly improve the wetting behavior compared to rosin fluxes used for leadtin solders. For the Sn-Zn eutectic solder on a Cu substrate at 260 C, it is found that the contact angle is reduced from 150 to about 25 when tinorganometallic fluxes are used instead of rosin flux. Severe accelerated tests (85% relative humidity at 85 C) for up to six weeks show that the mechanical properties of Sn-Zn eutectic solder interconnects are not affected adversely by the environment.

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Section: Al-sn-zn Systemmentioning

confidence: 99%

Some Fundamental Issues in the Use of Zn-Containing Lead-Free Solders for Electronic Packaging

2004

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“…Al-Sn, Al-Zn and Sn-Zn, has been selected for theoretical investigation. The two other principal reasons considered alongside the ones above are: (i) there seems to be a general consensus among researchers that the composition of new lead-free solders would be based on low-melting metals, and Sn and Zn seem to be the most promising ones, and (ii) the potential of Al-Sn-Zn for developing an alternative for lead-free solder [6,10] and/or its viability as a subsystem for developing complex alloy systems, such as the Al-Sn-Zn-Ag, have been reported in the literature [10,15].…”

Section: Introductionmentioning

confidence: 99%

“…Majority of investigated alloy systems are Sn-based, having Al, In, Sb, Zn, Bi, Au, Tl and Ag as a part of the alloy constituents. In particular, the studies have indicated Sn to be the major component in binary solders and that Sn-based multi-component alloys, such as ternary (Al-Sn-Zn, In-Sn-Zn, Sn-Ag-Cu) and/or quaternary (Sn-Ag-Cu-Sb, Sn-Ag-Cu-Zn) systems are more favored as a primary high-temperature alternative for lead-free solder [1,6,8]. Accordingly, the ternary Al-Sn-Zn alloy which is considered as an important system in lead-free soldering together with its binary subsystems, i.e.…”

Section: Introductionmentioning

confidence: 99%

“…In this regard, the new leadfree solder substitute being sought, have to meet some requirements, such as possession of excellent electrical conductivity, suitable melting temperature as well as good substrate wettability resulting * E-mail: yisau24@yahoo.co.uk in the formation of thin intermetallic layers at the solder/substrate interface [9]. Additional properties, such as high strength, good resistance to mechanical and thermal fatigue, corrosion resistance, environmental friendliness and relatively less expensive material have to be considered in the development of the new solders [2,6,8,10].…”

Section: Introductionmentioning

confidence: 99%

“…In the last two decades however, the development of lead-free solder materials have attracted much attention of researchers due to environmental and health issues associated with some materials including lead [1][2][3][4][5][6][7]. The use of lead and lead containing materials has been restricted by legislation worldwide, hence, the development of alternative lead-free solders with the same or possibly better characteristics than those of traditional Pb-Sn alloys is an important task that needs to be undertaken [8].…”

Section: Introductionmentioning

confidence: 99%

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Thermodynamic properties of Al in ternary lead-free solder Al-Sn-Zn alloys

Odusote

Popoola

Adedayo

et al. 2017

Materials Science-Poland

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Thermodynamic properties of Al were calculated using the molecular interaction volume model (MIVM) by analyzing the activities of components in the constitutive binary Al-Sn, Al-Zn and Sn-Zn subsystems of the ternary lead-free solder Al-Sn-Zn systems. The activities of Al content in the ternary system at three cross-sections with constant molar ratios of Sn:Zn = 2:1, 1:1 and 1:2, respectively, were calculated and compared with available experimental data at 973 K. Based on the agreement between the calculated activity values and corresponding literature data for Al-Sn-Zn alloys and their subsystems, the activity of Al content in the ternary Al-Sn-Zn system was estimated at the same cross-sections and mole ratios in the temperature range of 1073 K to 1373 K, respectively. It has been observed through the computed activity values of Al that the thermodynamic properties of the ternary Al-Sn-Zn systems do not change appreciably with temperature across the molar sections.

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Surface tension and viscosity of Sn‐based binary liquid alloys

Prasad

Jha

2005

Physica Status Solidi (a)

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The concentration‐dependent variation of the surface tension and viscosity of Sn–X (X = Ag, Bi, In and Zn) liquid alloys has been theoretically investigated. The grand partition function for the surface has been solved in the framework of quasi‐lattice approximations to obtain analytical expressions for the surface tension and surface composition of the different types of binary liquid alloys. For the computation of viscosity, an expression has been used that involves not only thermodynamic properties but also hard sphere diameter, masses and some microscopic functions. The hard sphere diameter of the constituent atoms in the binary systems has been calculated by minimizing the pair potential obtained from pseudopotential formalism. The theoretical investigation not only reproduces the experimental results but also predicts similar variations in surface tension and viscosity of these alloys with the increase of the Sn component. The viscosities and surface tension of Ag–Sn and Sn–Zn systems decrease with the addition of Sn atoms, showing a negative deviation from the additive rule of mixing. The extent of the deviation is large in Ag‐rich and Zn‐rich alloys. The Sn–In system exhibits a decrease in viscosity up to 20% Sn followed by linear values, while no appreciable change is observed in surface tension values. The surfaces of Ag–Sn and Sn–Zn are quite enriched with Sn atoms whereas the Sn–In system exhibits much less of a segregation of Sn. In contrast, both surface tension and viscosity of the Sn–Bi system increase with the increase of the Sn component. The surface composition of Sn–Bi is quite different from that of the other systems because of the segregation of Bi atoms. The difference of hard sphere diameters affects viscosity considerably. (© 2005 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

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Thermodynamic Properties of Liquid Al-Sn-Zn Alloys: A Possible New Lead-Free Solder Material

Cited by 31 publications

References 36 publications

Some Fundamental Issues in the Use of Zn-Containing Lead-Free Solders for Electronic Packaging

Some Fundamental Issues in the Use of Zn-Containing Lead-Free Solders for Electronic Packaging

Thermodynamic properties of Al in ternary lead-free solder Al-Sn-Zn alloys

Surface tension and viscosity of Sn‐based binary liquid alloys

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