Thermodynamic characteristics, microstructure and mechanical properties of Sn-0.7Cu-xIn lead-free solder alloy

Tian, Shuai; Li, Saipeng; Zhou, Jian; Xue, Feng

doi:10.1016/j.jallcom.2018.01.386

Cited by 32 publications

(8 citation statements)

References 36 publications

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“…20 Therefore, it would be very difficult to separate In signals from Sn, and in most cases the EDS results for In in solder appear to simply mimic the Sn distribution with a lower intensity. 4,9 That noted, studies have reported In segregation at the cathode interface due to a back stress created by diffusing Sn 3,11 so EDS mapping of the cathode interface was done to investigate this effect.…”

Section: Interfacial Imc Evolution During Electromigrationmentioning

confidence: 99%

“…In-containing alloys have gained popularity as a possible replacement for conventional Sn-Ag-Cu solders because of their low melting temperatures, [1][2][3][4][5] high shear and bending strengths, 6,7 greater hardness, 1,2 greater creep resistance, 1,8 and suppression of interfacial intermetallic compound (IMC) growth. 7,9 Additions of In into Sn-Cu, Sn-Ag and Sn-Ag-Bi solders showed the improved behaviors listed above, but the precise mechanism behind how In causes these changes is not well understood.…”

Section: Introductionmentioning

confidence: 99%

“…1 The extremely rapid cooling rate of the fabrication procedure could also have produced a fine IMC structure, so the effect of In here is unclear. Studies vary in reflow time from 60 s 12 to 10 min, 4 making comparisons in IMC formation impossible as a long reflow time will saturate Sn solder with Cu 6 Sn 5 IMC particles. To further complicate matters, In is soluble in Cu 3 Sn and Cu 6 Sn 5 but difficult to detect using EDS due to the energy overlap between Sn and In.…”

Section: Introductionmentioning

confidence: 99%

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Effect of Trace Addition of In on Sn-Cu Solder Joint Microstructure Under Electromigration

Kelly

Antoniswamy

Mahajan

et al. 2020

Journal of Elec Materi

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Recently In has been considered as an additional alloying element in Sn-rich solders primarily due to its abilities to decrease the solder melting temperature and to modify mechanical properties and microstructure. While In is an attractive candidate for addition to solder, its effect on solder microstructure is not well understood. In order to study the effect of minor In additions on Snrich solder alloys, solder joints were prepared using Sn-0.7 wt.% Cu and Sn-0.7 wt.% Cu-< 1 wt.% In alloys. Thermal aging and electromigration testing were done, followed by post-mortem microstructure characterization including composition, morphology, and grain structure. The addition of In did not appear to affect the microstructure under thermal aging conditions, but slowed interfacial intermetallic growth under electromigration, particularly of the compound Cu 6 Sn 5 . Transmission electron microscope analysis revealed the formation of Cu 7 In 3 IMC nanoparticles, which were semicoherent with the surrounding Sn matrix.

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Section: Interfacial Imc Evolution During Electromigrationmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Effect of Trace Addition of In on Sn-Cu Solder Joint Microstructure Under Electromigration

Kelly

Antoniswamy

Mahajan

et al. 2020

Journal of Elec Materi

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“…However, in recent years, due to rising concern about the high toxicity of lead, researchers have attempted to develop a variety of lead-free solders to replace the traditional Sn-Pb eutectic solder [ 2 , 3 ]. Those lead-free solders include Sn-Ag, Sn-Cu, Sn-Ag-Cu, Sn-Zn, Sn-Bi, Sn-In, and other lead-free solders [ 4 , 5 , 6 , 7 , 8 , 9 ]. The lead-free solders being developed are expected to possess a comparable or better performance than that of leaded solders.…”

Section: Introductionmentioning

confidence: 99%

Effect of Bi, Sb, and Ti on Microstructure and Mechanical Properties of SAC105 Alloys

et al. 2022

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The Sn-Ag-Cu (SAC) solder alloys with a low Ag (Ag < 3 wt.%) content have attracted great attention owing to their low cost, increased ability in bulk compliance, and plastic energy dissipation. However, some of their mechanical properties are generally lower than the SAC alloys with a higher Ag content. Adding alloying elements is an effective approach for improving the mechanical properties of the SAC alloys. In this study, the effect of Bi, Sb, and Ti on Sn-1 wt.%Ag-0.5 wt.%Cu (SAC105) solder alloys was investigated. The SAC solders with four compositions: SAC105-1 wt.%Bi, SAC105-1 wt.%Sb, SAC105-1 wt.%Bi-1 wt.%Sb, SAC105-1 wt.%Bi-1 wt.%Sb-0.4 wt.%Ti were prepared. The microstructure and phase compositions were characterized using electron scanning microscopy, and X-ray diffraction. The thermal properties and wettability were also examined. Uniaxial tensile tests and nano-indentation tests were conducted to evaluate the mechanical properties. The results show that adding Bi or Sb could increase the strength of SAC105 alloys mainly due to the solid solution strengthening effect. The creep resistance of SAC105 alloys was also improved with the additions of Bi and Sb. The co-additions of Bi and Sb into SAC105 alloys exhibit an enhanced creep resistance than that calculated by the theoretical calculation. The further addition of Ti into SAC105-1Bi-1Sb alloys demonstrated a much-improved creep resistance, which could be attributed to the synergistic effects of both solid solution strengthening and the precipitation hardening effects.

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“…However, the Pb containing materials have been restricted by legislation worldwide because of their harmfulness to the environment and human health [2,3]. In the recent years, development of the lead-free solder materials has attracted more attention among researchers [4][5][6][7][8][9][10]. To replace conventional Pb-Sn solders, the new lead-free solders should meet some requirements, such as the excellent electrical conductivity, optimal melting temperature, as well as good wetting joining surfaces [11].…”

Section: Introductionmentioning

confidence: 99%

Thermodynamic re-assessment of the Al-Sn-Zn ternary system

Tang

Zhang

2019

J min metall B Metall

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In this paper, a thermodynamic re-assessment of the Al-Sn-Zn ternary system was performed by means of the CALculation of PHAse Diagram (CALPHAD) approach. The thermodynamic descriptions of the binary Al-Sn, Al-Zn, and Sn-Zn systems from the literature were directly adopted, and the newly reported experimental phase equilibria, enthalpies of mixing, and activities of Al in the ternary liquid phase were taken into account. A set of self-consistent thermodynamic parameters for the ternary Al-Sn-Zn system were finally obtained. A comprehensive comparison between the presently calculated phase equilibria/thermodynamic properties and the experimental data indicates that the present thermodynamic descriptions of the ternary Al-Sn-Zn system show very good agreement with most of the experimental data. The further direct comparison with the calculated results due to the previous assessment demonstrates that a significant improvement was achieved by the present assessment though fewer ternary interaction parameters were utilized.

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Thermodynamic characteristics, microstructure and mechanical properties of Sn-0.7Cu-xIn lead-free solder alloy

Cited by 32 publications

References 36 publications

Effect of Trace Addition of In on Sn-Cu Solder Joint Microstructure Under Electromigration

Effect of Trace Addition of In on Sn-Cu Solder Joint Microstructure Under Electromigration

Effect of Bi, Sb, and Ti on Microstructure and Mechanical Properties of SAC105 Alloys

Thermodynamic re-assessment of the Al-Sn-Zn ternary system

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