Thermodynamic calculation of phase equilibria in the Cu–Ni–Zn system

Jiang, Min; Wang, C.P.; Liu, X.J.; Ohnuma, Ikuo; Kainuma, Ryosuke; Vassilev, G. P.; Ishida, K.

doi:10.1016/j.jpcs.2004.08.039

Cited by 22 publications

(7 citation statements)

References 17 publications

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“…Several papers on nickel silver have been published [8,9]. However, these studies are focused on the characterization of the morphological [10] and thermodynamical [11,12] properties of the electrodeposited alloys.…”

Section: Introductionmentioning

confidence: 99%

Comparative study on the electrochemical performance of the Cu–30Ni and Cu–20Zn–10Ni alloys

Zhou

Deng

2010

Journal of Alloys and Compounds

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Section: Introductionmentioning

confidence: 99%

Comparative study on the electrochemical performance of the Cu–30Ni and Cu–20Zn–10Ni alloys

Zhou

Deng

2010

Journal of Alloys and Compounds

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“…Cooling was calculated from the thermodynamic databases available in the literature using Software package Pandat (version 8.0) following a compilation of Refs. [13][14][15][16][17][18][19] as cited in our previous work [12] and an extension to other binary copper alloys . The solid fraction evolution within a relatively small fraction (f s ) as detailed in Table 1 was calculated based on the Gulliver-Scheil cooling conditions generally for a temperature step of 0.01K, except where otherwise stated in Table 1.…”

Section: True Growth Restriction Factor Qmentioning

confidence: 99%

On the Role of Dilute Solute Additions on Growth Restriction in Binary Copper Alloys

Balart

Gao

Patel

et al. 2020

Metallogr. Microstruct. Anal.

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The effect of dilute solute additions on growth restriction in binary Cu alloys has been assessed at different degrees of superheat. Columnar grain length values from Northcott’s work (Northcott in J Inst Metals 62:101-136, 1938) for binary Cu alloys were plotted against the corresponding undercooling parameter (P), the reciprocal of the conventional (Qconv.) and true (Qtrue) growth restriction factor (Schmid-Fetzer and Kozlov in Acta Mater 59(15):6133-6144, 2011) values. It was found that there was no correlation between the columnar grain length values and P, 1/Qconv. and 1/Qtrue values for different solutes and cast at the same degree of superheat. Unlike P, Qconv., and Qtrue values, the heuristic growth restriction parameter (β) (Fan et al. in Acta Mater 152, 248-257, 2018) modeling framework in conjunction with the critical solute content (C*) for growth restriction fitted well to binary Cu alloys.

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“…The development of the solid fraction (f s ) was calculated using the Scheil-Gulliver solidification equation generally for a temperature step of 0.01 °C, unless otherwise stated in Table 1. Software package Pandat (version 8.0) and the thermodynamic databases available in the literature [24][25][26][27][28][29][30] were used to calculate cooling.…”

Section: Thermodynamically Determined Qmentioning

confidence: 99%

Effects of Superheat and Solute Additions on the Grain Size in Binary Copper Alloys

Balart

Gao

Patel

et al. 2019

Metallogr. Microstruct. Anal.

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By utilizing data from the literature, we examine the effects of superheat and solute additions on the grain size (as measured by columnar grain length) in binary copper alloys. Our investigation provides support for an Arrhenius-like behavior of the superheat on the grain size. We also find a correlation between the columnar grain length at a constant degree of superheat and the variation of the reciprocal of the true growth restriction factor (1/Q) with P, Mg, Mn, Pb, and Sn solute additions to be a power of law of 1/3, which gave a better fit than a linear one.

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Thermodynamic calculation of phase equilibria in the Cu–Ni–Zn system

Cited by 22 publications

References 17 publications

Comparative study on the electrochemical performance of the Cu–30Ni and Cu–20Zn–10Ni alloys

Comparative study on the electrochemical performance of the Cu–30Ni and Cu–20Zn–10Ni alloys

On the Role of Dilute Solute Additions on Growth Restriction in Binary Copper Alloys

Effects of Superheat and Solute Additions on the Grain Size in Binary Copper Alloys

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