Thermo‐mechanical Properties of In‐situ Silica Filled Silicone Resins

Abstract

Silicone resins were investigated as a replacement of silica filled organic polymers for microelectronic packaging. Self‐curable silicone resins containing up to 40 mol% of in‐situ generated silica‐like species were prepared by a novel process involving controlled hydrolysis‐condensation of SiH moieties without gelation. These in‐situ Q filled resins are stable and easy to process compared to post‐filled organic polymers. The thermo‐mechanical properties upon self‐addition and condensation cure of the in‐situ filled silicone resins are superior to conventional addition and condensation cured silicone resins and are in the range of organic polymers with the added advantage of high thermal and moisture resistance critical in microelectronic. Storage modulus and plateau modulus as high as 3.5 GPa with a very low fall in modulus below 5% were demonstrated. Coefficients of thermal expansion were as low as 55 to 65 ppm/K in the application temperature up to 170 °C.

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